公开(公告)号：US20230352454A1

公开(公告)日：2023-11-02

申请号：US18330495

申请日：2023-06-07

Applicant: AGC Inc.

Inventor： Yohei NAGAO ,  Takenori SOMEYA

IPC: H01L33/44 ,  H01L33/48 ,  H01L25/075 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L25/075 ,  H01L33/0083 ,  H01L33/44 ,  H01L33/486 ,  H01L33/58

Abstract: A bonded body includes a first base material; a second base material; an inorganic film for bonding the first base material and the second base material; and a semiconductor layer formed on a surface opposite to a bonding surface of the second base material, the bonding surface of the second base material facing the first base material, wherein the first base material is a glass with a SiO2 content of 70 mol% or less, and the inorganic film includes a silicon oxide film formed on a bonding surface of the first base material, the bonding surface of the first base material facing the second base material.