Method for control of ionization electrostatic plating
    1.
    发明授权
    Method for control of ionization electrostatic plating 失效
    控制离子静电镀层的方法

    公开(公告)号:US3900585A

    公开(公告)日:1975-08-19

    申请号:US33149473

    申请日:1973-02-12

    CPC classification number: C23C14/32 C23C14/04 C23C14/044

    Abstract: In a plating process wherein a DC electrical potential is applied in a rare gas atmosphere between a positive electrode (anode) which is a boat containing a coating material and a negative electrode (cathode) which is an article subjected to plating so that glow discharge is induced and then the coating material in the boat is vaporized and the vaporized coating material is deposited fast on the article being plated, the present invention provides an improvement which comprises disposing a focusing tube and a dispersing torpedo, both of which are subjected to positive electrical potential, between the two electrodes. The electric lines of force formed between the two electrodes are focused by the focusing tube and dispersed by the torpedo. The pattern in which the electric lines of force are dispersed can easily be controlled by the position and shapes of the focusing tube and the torpedo and the magnitude of electric potential involved. By disposing the focusing tube and the torpedo so as to cause the electric lines of force to concentrate at specific parts of the article being plated, therefore, the vaporized and ionized coating material can be deposited fast on the article along the bundle of electric lines of force. Consequently, possible straying of the vaporized coating material can be minimized and, at the same time, the distribution of the film thickness of coating material to be deposited on the article can be freely adjusted.

Patent Agency Ranking