CONDUCTOR SHAPING APPARATUS AND METHOD
    1.
    发明申请
    CONDUCTOR SHAPING APPARATUS AND METHOD 审中-公开
    导体形状设备和方法

    公开(公告)号:US20160248306A1

    公开(公告)日:2016-08-25

    申请号:US15027854

    申请日:2014-11-13

    IPC分类号: H02K15/04 H02K3/28

    CPC分类号: H02K15/04 H02K3/28

    摘要: A conductor shaping apparatus with first and second shaping dies that are movable toward and away from each other along a first direction, and that are moved toward each other to shape the at least one first bent portion and the at least one second bent portion, wherein one of the first and second shaping dies is configured to be moved away from the other along a second direction that is different from the first direction such that the conductor is not dragged when the first and second shaping dies are moved away from each other along the first direction after shaping of the first and second bent portions is completed.

    摘要翻译: 一种具有第一和第二成形模具的导体成形设备,其可沿着第一方向彼此相对移动并且彼此相对移动,并且朝向彼此移动以使所述至少一个第一弯曲部分和所述至少一个第二弯曲部分成形,其中 第一成形模具和第二成形模具中的一个成形模具被构造成沿着与第一方向不同的第二方向彼此远离,使得当第一和第二成形模具沿着第一和第二成形模具彼此远离地移动时,导体不被拖动 完成第一和第二弯曲部分的成形之后的第一方向。