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公开(公告)号：US11577343B2
公开(公告)日：2023-02-14
申请号：US16022337
申请日：2018-06-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Md Hasnine , Lik Wai Kho
Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.
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2.发明授权公开(公告)号：US11732330B2
公开(公告)日：2023-08-22
申请号：US16022345
申请日：2018-06-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Md Hasnine , Lik Wai Kho
CPC classification number: C22C13/00 , B23K35/262 , C22C13/02 , B23K35/025 , B23K35/0227 , B23K35/0244
Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
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公开(公告)号：US20230356333A1
公开(公告)日：2023-11-09
申请号：US18217156
申请日：2023-06-30
Applicant: Alpha Assembly Solutions Inc.
Inventor： Md Hasnine , Lik Wai Kho
CPC classification number: B23K35/262 , B23K35/26 , C22C13/00 , C22C13/02 , B23K35/0244
Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
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4.发明公开公开(公告)号：US20230340642A1
公开(公告)日：2023-10-26
申请号：US18215929
申请日：2023-06-29
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Md Hasnine , Lik Wai Kho
CPC classification number: C22C13/00 , B23K35/262 , C22C13/02 , B23K35/0244
Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
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