公开(公告)号：US20240363571A1

公开(公告)日：2024-10-31

申请号：US18766832

申请日：2024-07-09

申请人： Senju Metal Industry Co., Ltd.

发明人： Yoshie Yamanaka ,  Hikaru Nomura ,  Ken Tachibana ,  Shunsaku Yoshikawa

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H05K3/34

CPC分类号： H01L24/13 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0261 ,  B23K35/26 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H01L24/11 ,  H05K3/3457 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1301 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/2076 ,  H05K2203/041

摘要： A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, at least one of Fe and Co in a total amount of 0.003-0.1 mass %, and a remainder of Sn.

公开(公告)号：US20230356333A1

公开(公告)日：2023-11-09

申请号：US18217156

申请日：2023-06-30

申请人： Alpha Assembly Solutions Inc.

发明人： Md Hasnine ,  Lik Wai Kho

IPC分类号： B23K35/26 ,  C22C13/02 ,  C22C13/00

CPC分类号： B23K35/262 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  B23K35/0244

摘要： A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

公开(公告)号：US20230311451A1

公开(公告)日：2023-10-05

申请号：US18043218

申请日：2021-06-25

申请人： NGK SPARK PLUG CO., LTD.

发明人： Osamu YOSHIMOTO ,  Ryuichi ARAKAWA ,  Tomoo TANAKA

IPC分类号： B32B9/04 ,  B32B7/12 ,  B32B15/20 ,  B32B15/02 ,  B32B9/00 ,  C04B37/02 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26

CPC分类号： B32B9/041 ,  B32B7/12 ,  B32B15/20 ,  B32B15/02 ,  B32B9/005 ,  C04B37/023 ,  B23K1/0016 ,  B23K35/0233 ,  B23K35/26 ,  H01L21/6833

摘要： A joining layer of a joined body includes a joining material which contains, as a main component, a metal having a surface tension of 1000 mN/m or less at its melting point, and a metal layer which has a plurality of pores formed therein and in which at least some of the pores are impregnated with the joining material.

公开(公告)号：US11673214B2

公开(公告)日：2023-06-13

申请号：US17664907

申请日：2022-05-25

申请人： Uchihashi Estec Co., Ltd.

发明人： Yoshihiro Yoshioka ,  Kazuo Inada ,  Tomokuni Mitsui ,  Hitoshi Yamanaka

IPC分类号： B23K35/26 ,  C22C28/00

CPC分类号： B23K35/26 ,  C22C28/00

摘要： A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.

公开(公告)号：US20180311773A1

公开(公告)日：2018-11-01

申请号：US16030009

申请日：2018-07-09

申请人： HARIMA CHEMICALS, INCORPORATED

发明人： Shunsuke ISHIKAWA ,  Kensuke NAKANISHI ,  Yuka MATSUSHIMA ,  Tadashi TAKEMOTO

IPC分类号： B23K35/26 ,  C22C13/02 ,  B23K35/02 ,  B23K101/42

CPC分类号： B23K35/262 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/42 ,  C22C13/02

摘要： In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

公开(公告)号：US10016848B2

公开(公告)日：2018-07-10

申请号：US15334898

申请日：2016-10-26

申请人： NAPRA CO., LTD.

发明人： Shigenobu Sekine

IPC分类号： B22F1/02 ,  B23K35/02 ,  B22F1/00 ,  C22C13/00 ,  H01L23/00 ,  B23K35/26 ,  B23K35/30 ,  C22C9/02 ,  H01B1/22

CPC分类号： B23K35/025 ,  B22F1/0048 ,  B22F1/025 ,  B22F2301/30 ,  B22F2301/40 ,  B22F2303/15 ,  B22F2303/30 ,  B22F2304/10 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  C22C9/02 ,  C22C13/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/04 ,  H01B1/22 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/13311 ,  H01L2224/13411 ,  H01L2224/13447 ,  H01L2924/01327

摘要： Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.

公开(公告)号：US20180174991A1

公开(公告)日：2018-06-21

申请号：US15832905

申请日：2017-12-06

申请人： Senju Metal Industry Co., Ltd.

发明人： Tomoaki Nishino ,  Shigeki Kondo ,  Takahiro Hattori ,  Hiroyoshi Kawasaki ,  Takahiro Roppongi ,  Daisuke Soma ,  Isamu Sato

IPC分类号： H01L23/00 ,  C22C12/00 ,  C22C13/02 ,  B23K35/02 ,  B23K35/26 ,  B23K1/00

CPC分类号： H01L24/13 ,  B22F1/0003 ,  B22F1/025 ,  B22F2999/00 ,  B23K1/0016 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  C22C5/00 ,  C22C9/00 ,  C22C12/00 ,  C22C13/02 ,  C25D3/60 ,  C25D5/10 ,  C25D5/12 ,  C25D7/00 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13179 ,  H01L2224/1318 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01057 ,  H01L2924/014 ,  H01L2924/3841 ,  H05K3/34 ,  C22C1/0483

摘要： A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

公开(公告)号：US09999123B2

公开(公告)日：2018-06-12

申请号：US15075064

申请日：2016-03-18

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Arata Kishi ,  Tadashi Maeda ,  Tadahiko Sakai

IPC分类号： H05K1/02 ,  H05K1/11 ,  B23K1/00 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  H05K1/14 ,  H05K1/09 ,  H05K1/00 ,  H05K7/00 ,  H01R12/71

CPC分类号： H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

摘要： A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

公开(公告)号：US20180117715A1

公开(公告)日：2018-05-03

申请号：US15569106

申请日：2016-04-25

申请人： NEC Corporation

发明人： Yuuki MOMOKAWA

IPC分类号： B23K35/26 ,  B23K35/02 ,  C22C13/00 ,  H05K1/18

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/36 ,  C22C1/0483 ,  C22C13/00 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10734

摘要： In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by the solder, the present invention provides a solder alloy that comprises 2.0 to 4.0 mass % of Ag, 0.5 to 1.0 mass % of Cu, 0.1 to 0.5 mass % of an additive element selected from the group consisting of Ca and Mn, and a balance of Sn.

公开(公告)号：US09919384B2

公开(公告)日：2018-03-20

申请号：US14740321

申请日：2015-06-16

申请人： NICHIA CORPORATION

发明人： Toshiya Igata ,  Hirofumi Yoshida

IPC分类号： F21V15/00 ,  B23K35/30 ,  B23K1/00 ,  H01L33/48 ,  H01L33/58 ,  B23K35/26 ,  B23K35/36 ,  B23K35/02 ,  B23K101/42 ,  B23K103/18 ,  B23K103/00 ,  B23K103/02 ,  B23K103/08 ,  B23K103/12

CPC分类号： B23K35/3013 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0255 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3613 ,  B23K2101/42 ,  B23K2103/02 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/42 ,  B23K2103/52 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014

摘要： A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a light-transmissive member covering an opening of the recess, and a frame member bonded to the package. The light-transmissive member is held by and between the package and the frame member.