公开(公告)号：US20180132373A1

公开(公告)日：2018-05-10

申请号：US15803899

申请日：2017-11-06

Applicant: AMETEK, INC.

Inventor： Charles M. Italiano ,  Thomas A. Bobal ,  Maurice P.C. Mevissen

IPC: H05K5/06 ,  H05K5/03 ,  H05K5/04

CPC classification number: H05K5/069 ,  H01L21/4803 ,  H01L23/10 ,  H05K5/03 ,  H05K5/04

Abstract: Aspects of the invention relate to cover assemblies and methods for manufacturing such cover assemblies. According to one aspect of the invention, a cover assembly is provided for hermetically sealing electronic circuitry. The cover assembly includes a cover having a frame connection surface. The frame connection surface has a periphery section extending along an outer portion of the frame connection surface. The cover assembly also includes a frame having an annulus shape and a cover connection surface and a package connection surface spaced from the cover connection surface. Additionally, the cover assembly includes a laser weld that couples the cover connection surface of the frame to the frame connection surface of the cover in the periphery section to form the cover assembly. The package connection surface of the frame is exposed for attachment to the substrate after the cover assembly is formed.