公开(公告)号：US20240321692A1

公开(公告)日：2024-09-26

申请号：US18573297

申请日：2022-06-24

申请人： AMOSENSE CO., LTD.

发明人： Jinhyuck BIN ,  Hyeonchoon CHO ,  Taeho CHO ,  Intae YEO ,  Ikseong PARK ,  Seunggon PARK

IPC分类号： H01L23/49 ,  H01L23/00 ,  H01L23/373 ,  H01L25/07

CPC分类号： H01L23/49 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48155 ,  H01L2224/73265 ,  H01L2924/1033 ,  H01L2924/30107 ,  H01L2924/3512

摘要： The present disclosure relates to a power module comprising: a base plate; a ceramic substrate bonded to the top surface of the base plate; a semiconductor chip bonded to the top surface of the ceramic substrate; a spacer bonded to the top surface of the ceramic substrate so as to be spaced apart from the semiconductor chip; a connection pin provided at an electrode layer formed on the top surface of the spacer; and a bonding wire for connecting a terminal of the semiconductor chip to the electrode layer of the spacer.