公开(公告)号：US20220216353A1

公开(公告)日：2022-07-07

申请号：US17601835

申请日：2020-03-27

Applicant: ams AG

Inventor： Harald ETSCHMAIER ,  Gerhard PEHARZ ,  Arnold UMALI ,  Martin FACCINELLI

IPC: H01L31/0232 ,  H01L31/0203 ,  G02B5/02

Abstract: An apparatus comprises an optical sensor package that includes an optical sensor die. The optical sensor package further includes a reflow-stable optical diffuser disposed over the optical sensor die. The optical diffuser is surrounded laterally by an epoxy molding compound.

公开(公告)号：US20160163750A1

公开(公告)日：2016-06-09

申请号：US14906263

申请日：2014-06-25

Applicant: AMS AG

Inventor： Arnold UMALI ,  Harald ETSCHMAIER ,  Guenter AFLENZER

IPC: H01L27/146 ,  H01L23/29 ,  H01L23/552

CPC classification number: H01L27/14618 ,  H01L23/293 ,  H01L23/552 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package for an optical sensor, comprises an optically opaque enclosure for forming a cavity when mounted onto a substrate and an optical element based on an optically translucent polymer. An aperture in the enclosure is designed to attach the optical element to the enclosure.

Abstract translation: 用于光学传感器的封装包括光学不透明的外壳，用于在安装到基板上时形成空腔，以及基于光学半透明聚合物的光学元件。 外壳中的孔被设计成将光学元件附接到外壳。