公开(公告)号：US09911563B2

公开(公告)日：2018-03-06

申请号：US13955866

申请日：2013-07-31

Applicant: ANALOG DEVICES GLOBAL

Inventor： John G Macnamara ,  Padraig L. Fitzgerald ,  Raymond C Goggin ,  Bernard P Stenson

IPC: H01H59/00 ,  B81C1/00 ,  B81B7/00 ,  H01H1/00

CPC classification number: H01H59/0009 ,  B81B7/007 ,  B81B2201/014 ,  B81B2207/092 ,  B81C1/00341 ,  H01H2001/0052 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/181 ,  Y10T307/937 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS switch device including: a substrate layer; an insulating layer formed over the substrate layer; and a MEMS switch module having a plurality of contacts formed on the surface of the insulating layer, wherein the insulating layer includes a number of conductive pathways formed within the insulating layer, the conductive pathways being configured to interconnect selected contacts of the MEMS switch module.