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1.发明申请INSULATING LOW SIGNAL LOSS SUBSTRATE, INTEGRATED CIRCUITS INCLUDING A NON-SILICON SUBSTRATE AND METHODS OF MANUFACTURE OF INTEGRATED CIRCUITS 审中-公开绝缘低信号损耗基板，包含非硅基板的集成电路和集成电路的制造方法公开(公告)号：US20140240944A1
公开(公告)日：2014-08-28
申请号：US13776545
申请日：2013-02-25
Applicant: ANALOG DEVICES TECHNOLOGY
Inventor： Bernard P. Stenson , Michael Morrissey , Seamus A. Lynch
IPC: B81B7/00
CPC classification number: H01L28/00 , H01L27/016 , H01L28/10 , H01L28/20 , H01L28/60
Abstract: A microelectronic circuit having at least one component adjacent a carrier which is not a semiconductor or sapphire.
Abstract translation: 微电子电路具有与不是半导体或蓝宝石的载体相邻的至少一个分量。
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