公开(公告)号：US20160154124A1

公开(公告)日：2016-06-02

申请号：US14907611

申请日：2013-07-26

Applicant: ANALOGIC CORPORATION

Inventor： Randy LUHTA ,  Daniel ABENAIM ,  Martin CHOQUETTE ,  Ruvin DEYCH ,  Chris VRETTOS

IPC: G01T1/24 ,  G01T1/20

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L27/14618 ,  H01L27/14661 ,  H01L2224/16225

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract translation: 提供了一种用于辐射成像模式的检测器阵列的检测器单元。 在一些实施例中，检测器单元包括辐射检测子组件和电子子组件。 在一些实施例中，可以经由半导体制造技术形成检测器单元的至少一些部分，例如电子学子组件。 作为示例，电子子组件可以经由半导体制造技术形成，并且可以包括嵌入模制化合物中的电子电路。 在一些实施例中，这种电子电路可以通过导电迹线和/或通孔电耦合在一起。

公开(公告)号：US20180210096A1

公开(公告)日：2018-07-26

申请号：US15745186

申请日：2015-09-18

Applicant: ANALOGIC CORPORATION

Inventor： Randy LUHTA ,  Chris VRETTOS

IPC: G01T1/24 ,  G01T1/20 ,  H01L27/146 ,  H01L23/498

CPC classification number: G01T1/244 ,  G01T1/2018 ,  H01L23/49816 ,  H01L27/14618 ,  H01L27/14661 ,  H01L27/14663 ,  H01L2224/32145 ,  H03M1/12

Abstract: Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.