Micro speaker having a hermetically sealed acoustic chamber with increased volume

    公开(公告)号:US10433048B2

    公开(公告)日:2019-10-01

    申请号:US15693329

    申请日:2017-08-31

    Applicant: Apple Inc.

    Abstract: A micro speaker assembly including a speaker enclosure having an enclosure wall separating a surrounding environment from an encased space, wherein the enclosure wall defines, in part, an acoustic channel that acoustically couples the encased space to the surrounding environment, and the enclosure wall comprises a chemically etched insert molded metal portion that is mechanically interlocked and hermetically sealed to a plastic portion. The micro speaker further including a speaker assembly positioned within the encased space, the speaker assembly having a sound radiating surface facing the metal portion of the enclosure wall, a voice coil extending from the sound radiating surface, a magnet assembly having a magnetic gap aligned with the voice coil, and an acoustic chamber formed, in part, by the metal portion of the enclosure wall and the sound radiating surface.

    Devices With Radio-Frequency Printed Circuits

    公开(公告)号:US20190261509A1

    公开(公告)日:2019-08-22

    申请号:US16212453

    申请日:2018-12-06

    Applicant: Apple Inc.

    Abstract: Dielectric such as polyether ether ketone may be used in forming radio-frequency flexible printed circuits. Filler may be incorporated into the dielectric to adjust the coefficient of thermal expansion of the flexible printed circuit. One or more layers of the flexible printed circuit may be unfilled and one or more layers of the flexible printed circuit may be filled. Antennas may be formed from metal traces on the flexible printed circuit, metal electronic device housing structures, or other conductive structures. A transmission line on the flexible printed circuit may couple radio-frequency transceiver circuitry in an electronic device to an antenna. A flexible printed circuit may have a portion with enhanced bendability in a location that overlaps a bend region. The enhanced bendability region may have less filler than other portions of the flexible printed circuit.

    HOUSING FEATURES OF AN ELECTRONIC DEVICE
    6.
    发明申请

    公开(公告)号:US20190141171A1

    公开(公告)日:2019-05-09

    申请号:US16241914

    申请日:2019-01-07

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    Housing features of an electronic device
    9.
    发明授权
    Housing features of an electronic device 有权
    电子设备的外壳特性

    公开(公告)号:US09591110B2

    公开(公告)日:2017-03-07

    申请号:US14618744

    申请日:2015-02-10

    Applicant: Apple Inc.

    CPC classification number: H04M1/0249

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    Abstract translation: 公开了一种用于形成外壳的外壳和方法。 外壳可以由诸如铝的金属形成,并且还包括允许透射和接收电磁波的非金属部分。 非金属部分可以互锁到外壳,特别是与外壳内的区域相连,包括与非金属部分相比具有相对高的强度和刚度的第一材料。 联锁装置可以包括形成燕尾切口进入外壳以接纳非金属部分,钻入包围内部的孔或空腔,其包括内螺纹,以及插入第一材料中的杆以向非金属部分提供张力。 还公开了使用阳极氧化组装内部部件的方法。

    HOUSING FEATURES OF AN ELECTRONIC DEVICE

    公开(公告)号:US20210344784A1

    公开(公告)日:2021-11-04

    申请号:US17378695

    申请日:2021-07-17

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

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