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    SUPPORT PLATE THIN CLADDING
    3.
    发明申请
    SUPPORT PLATE THIN CLADDING 审中-公开

    公开(公告)号：US20200337184A1

    公开(公告)日：2020-10-22

    申请号：US16708159

    申请日：2019-12-09

    Applicant: Apple Inc.

    Inventor： Robert F. Meyer ,  William A. Counts ,  Michael D. Quinones ,  Jason P. Shannon ,  David A. Pakula

    IPC: H05K7/20 ,  F28F21/02 ,  F28F21/08

    Abstract: An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

    Speaker coupling and bracket
    5.
    发明授权
    Speaker coupling and bracket 有权

    公开(公告)号：US09872094B2

    公开(公告)日：2018-01-16

    申请号：US14975508

    申请日：2015-12-18

    Applicant: Apple Inc.

    Inventor： Robert F. Meyer ,  Daniel W. Jarvis ,  Richard Hung Minh Dinh ,  Stoyan Hristov

    IPC: H04R1/02

    CPC classification number: H04R1/023 ,  H04R2499/11

    Abstract: This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.

    SPEAKER COUPLING AND BRACKET
    6.
    发明申请
    SPEAKER COUPLING AND BRACKET 有权
    扬声器联轴器和支架

    公开(公告)号：US20170070795A1

    公开(公告)日：2017-03-09

    申请号：US14975508

    申请日：2015-12-18

    Applicant: Apple Inc.

    Inventor： Robert F. Meyer ,  Daniel W. Jarvis ,  Richard Hung Minh Dinh ,  Stoyan Hristov

    IPC: H04R1/02 ,  H04R1/04 ,  H04R1/34

    CPC classification number: H04R1/023 ,  H04R2499/11

    Abstract: This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.

    Abstract translation: 本申请涉及包括扬声器组件和麦克风的音频组件。 通过将麦克风和扬声器组件安装到单一音频支架，可以通过依赖于每个组件的单独支架的配置实现空间节省。 在一些实施例中，声学网格可嵌入在音频支架内并且延伸穿过由音频支架限定的音频通道。 麦克风可以通过与麦克风耦合的对准夹与音频支架中的开口对齐。 对准夹有助于实现麦克风的传感器开口与由音频支架定义的通道的对准。

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