公开(公告)号：US20230421676A1

公开(公告)日：2023-12-28

申请号：US18243426

申请日：2023-09-07

Applicant: Apple Inc.

Inventor： Jon F. Housour ,  Macey E. Dade ,  Benjamin R. Gray ,  Reema Shalan ,  Daniel W. Jarvis ,  Jason P. Shannon ,  Marwan Rammah ,  Robert F. Meyer ,  Richard H. Koch ,  Anthony B. Sinclair ,  Gareth L. Rose

IPC: H04M1/02

CPC classification number: H04M1/0266 ,  H04M1/0283 ,  H04M1/0264 ,  H04M1/0262 ,  H04M2207/18

Abstract: A mobile phone may include an enclosure including a front cover assembly defining a front exterior surface of the enclosure, a rear cover assembly defining a rear exterior surface of the enclosure, and a housing subassembly positioned between the front cover assembly and the rear cover assembly. The housing subassembly may include a first housing component defining a first side exterior surface of the enclosure, a second housing component defining a second side exterior surface of the enclosure opposite the first side exterior surface of the enclosure, and a lower chassis section extending between the first housing component and the second housing component. The mobile phone may further include a camera array coupled to the lower chassis section and positioned in an interior cavity defined between the lower chassis section and the front cover assembly.

公开(公告)号：US20250085400A1

公开(公告)日：2025-03-13

申请号：US18830624

申请日：2024-09-11

Applicant: Apple Inc.

Inventor： Xiaoyin Zhu ,  Ali M. Khan ,  Andrea Manavella ,  Andrej Halabica ,  April D. Schriker ,  Austin Y. Seol ,  Bhavin J. Bijlani ,  Caihua Chen ,  Chin Han Lin ,  Cristiano L. Niclass ,  David Sicard ,  Eric D. Aspnes ,  Hazel A. McInnes ,  Henry M. Daghighian ,  Igor Raginski ,  Jiayang Cao ,  Jibum Cha ,  Jili Liu ,  Jose M. Infante Herrero ,  Julien Sarry ,  Karen A. Cabrera ,  Lorenzo Ferrari ,  Niv Gilboa ,  Noriaki Saika ,  Pietro R. Binetti ,  Pushkar Pandit ,  Reema Shalan ,  Scott T. Smith ,  Shifa Xu ,  Shingo Mandai ,  Shujun Tang ,  Sibi Sutty ,  Susan A. Thompson ,  Teimour T. Maleki ,  Thierry Oggier ,  Vikrant Dhamdhere ,  Yohai Zmora ,  Yuanlin Xie ,  Wee Keat Chong

IPC: G01S7/481 ,  G01S17/894 ,  G03B30/00 ,  H04N13/239 ,  H04N23/51 ,  H04N23/56 ,  H04N23/74

Abstract: An optoelectronic assembly includes: (i) a substrate having a cavity, (ii) an optoelectronic device, which is disposed over the cavity and includes an array of multiple emitters configured to emit a predefined number of light beams in response to receiving one or more electrical signals, and (iii) an integrated circuit (IC), which is mounted within the cavity, between the substrate and the optoelectronic device, and is configured to drive the one or more electrical signals to the optoelectronic device.

公开(公告)号：US20230421677A1

公开(公告)日：2023-12-28

申请号：US18243448

申请日：2023-09-07

Applicant: Apple Inc.

Inventor： Jon F. Housour ,  Macey E. Dade ,  Benjamin R. Gray ,  Reema Shalan ,  Daniel W. Jarvis ,  Jason P. Shannon ,  Marwan Rammah ,  Robert F. Meyer ,  Richard H. Koch ,  Lee E. Hooton ,  Christopher S. Tomasetta

IPC: H04M1/02

CPC classification number: H04M1/0266

Abstract: A mobile phone may include a housing. The housing may include a first housing component including a cladding portion formed from a first metal and defining a first portion of a side exterior surface of the mobile phone, and a core portion coupled to the cladding portion, the core portion defining a portion of an interior surface of the mobile phone and formed from a second metal different from the first metal, a second housing component defining a second portion of the side exterior surface of the mobile phone, and a joint structure coupled to the first housing component and the second housing component and defining a third portion of the side exterior surface of the mobile phone between the first portion of the side exterior surface and the second portion of the side exterior surface. The cladding portion may be bonded directly to the core portion.