公开(公告)号：US20160135252A1

公开(公告)日：2016-05-12

申请号：US14997529

申请日：2016-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander MATYUSHKIN ,  Dan KATZ ,  John HOLLAND ,  Theodoros PANAGOPOULOS ,  Michael D. WILLWERTH

IPC: H05B3/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H05B3/0047 ,  B05C13/00 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/6833

Abstract: A substrate support assembly comprises a ceramic puck having a substrate receiving surface and an opposing backside surface. The ceramic puck has an electrode and a heater embedded therein. The heater comprises first and second coils that are radially spaced apart. A base of the support assembly comprises a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself. A compliant layer bonds the ceramic puck to the base.

Abstract translation: 衬底支撑组件包括具有衬底接收表面和相对的背面的陶瓷盘。 陶瓷盘具有嵌入其中的电极和加热器。 加热器包括径向间隔开的第一和第二线圈。 支撑组件的底座包括用于使流体循环通过的通道，该通道包括彼此相邻的入口和末端，使得通道自行回缩。 柔性层将陶瓷盘结合到基座上。