公开(公告)号：US20140329439A1

公开(公告)日：2014-11-06

申请号：US13874495

申请日：2013-05-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Xiong Yeu Chew ,  Kommisetti Subrahmanyam ,  Uday Mahajan ,  Bogdan Swedek ,  Rajeev Bajaj ,  Jianshe Tang

IPC: B24B37/005

CPC classification number: B24B37/0053

Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

Abstract translation: TSV（通过硅通孔）显示使用CMP（化学机械抛光）的方法可以被声学监测和控制，以检测TSV断裂并自动响应于此。 可以分析由位于CMP系统的衬底保持器和/或抛光垫附近的一个或多个声学传感器接收的声发射，以在CMP处理期间检测TSV断裂。 响应于检测到TSV断裂，可能会自动发生一个或多个补救措施。 在一些实施例中，抛光垫压板可以具有集成在其中的一个或多个声学传感器，其延伸到安装在抛光垫压板上的抛光垫中。 还提供了监测和控制TSV显示过程的方法，以及其他方面。