公开(公告)号：US20230166299A1

公开(公告)日：2023-06-01

申请号：US17870340

申请日：2022-07-21

申请人： Samsung Electronics Co., Ltd.

发明人： Jongsu KIM ,  Johnho KUK ,  Sunil PARK ,  Kwangsung LEE ,  Yoichiro IWA ,  Sewon JEON ,  Youngho JUNG

IPC分类号： B08B3/02 ,  B24B37/005

CPC分类号： B08B3/02 ,  B24B37/0053

摘要： A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.

公开(公告)号：US20140242730A1

公开(公告)日：2014-08-28

申请号：US13779542

申请日：2013-02-27

申请人： Applied Materials, Inc.

发明人： Jeffrey Drue David

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  B24B37/0053 ,  B24B49/12 ,  G01B11/0625 ,  H01L22/26

摘要： An optical model for a layer stack has a plurality of input parameters, the plurality of input parameters defining a parameter space. A plurality of model spectra are generated by calculating a model spectrum using the optical model for each of a first plurality of different points in the parameter space. A test spectrum of a test substrate is measured. For each model spectrum of the plurality of model spectra, the test spectrum is compared to the model spectrum to determine a difference value, thereby generating a plurality of difference values. A plurality of minima in the plurality of difference values are determined. Reference spectra can be generated clustered around points in the parameter space corresponding to a local minimum from the plurality of minima, or the local minimum can be used as a seed value in fitting the optical model to a measured spectrum.

摘要翻译： 用于层堆叠的光学模型具有多个输入参数，所述多个输入参数定义参数空间。 通过使用参数空间中的第一多个不同点中的每一个的光学模型来计算模型谱来生成多个模型光谱。 测量测试基板的测试光谱。 对于多个模型光谱的每个模型光谱，将测试光谱与模型光谱进行比较以确定差值，从而产生多个差值。 确定多个差值中的多个最小值。 参考光谱可以围绕与多个最小值中的局部最小值相对应的参数空间中的点聚集，或者可以将局部最小值用作将光学模型拟合到测量光谱中的种子值。

公开(公告)号：US20100327900A1

公开(公告)日：2010-12-30

申请号：US12829971

申请日：2010-07-02

申请人： Jeffrey P. Schmidt ,  Jay Rohde ,  Stacy Meyer

发明人： Jeffrey P. Schmidt ,  Jay Rohde ,  Stacy Meyer

IPC分类号： G01R31/26

CPC分类号： B24B37/34 ,  B24B37/0053

摘要： A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.

摘要翻译： 在具有用于支撑测试晶片的基座和可控基座致动器的测试台中测试抛光头，以将基座中心晶片支撑表面和测试晶片移向抛光头。 在本说明书的另一方面，测试晶片可以使用具有定位在基座中心晶片支撑表面周围的第一多个测试晶片接合构件的定位器定位。 在另一方面，晶片位置可以具有第二多个测试晶片接合构件，其位于围绕基座中心晶片支撑表面设置并适于支撑测试晶片的外部晶片支撑表面周围。 第二多个测试晶片接合构件可以围绕环构件的第二圆周分布，第二圆周具有比第一圆周更宽的直径。 描述和要求保护附加的实施例和方面。

公开(公告)号：US07121934B2

公开(公告)日：2006-10-17

申请号：US11133148

申请日：2005-05-18

申请人： Taek-Soo Jung

发明人： Taek-Soo Jung

IPC分类号： B24B29/00

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to a rear surface of a membrane during a polishing process through a perforated hole formed at a center of the membrane lower holder. A center portion of the membrane is connected to a vacuum pipe by passing through a hole of the membrane lower holder and the adjustment chamber. Vacuum pressure is directly applied to a wafer so that the wafer is easily attached to the carrier head at lower pressure. Pressure is evenly distributed over the whole area of the wafer so that the wafer is evenly polished.

摘要翻译： 公开了一种用于平坦化半导体晶片的化学机械抛光装置的承载头。 调节室设置在形成在薄膜下支架和晶片支撑组件的薄膜上支架之间的空间部分中。 施加到调节室的压力在抛光过程中通过形成在膜下支架的中心的穿孔而被转移到膜的后表面。 膜的中心部分通过膜下部保持器和调节室的孔连接到真空管。 将真空压力直接施加到晶片，使得晶片在较低的压力下容易地附接到载体头。 压力均匀分布在晶片的整个区域上，从而使晶片均匀抛光。

公开(公告)号：US06905392B2

公开(公告)日：2005-06-14

申请号：US10609996

申请日：2003-06-30

申请人： Brian E. Bottema ,  Keven A. Cline ,  Morris S. Poteet

发明人： Brian E. Bottema ,  Keven A. Cline ,  Morris S. Poteet

IPC分类号： B24B37/005 ,  B24B37/30 ,  B24B49/00 ,  B24B47/02

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A system for polishing a substrate has a controller, pressure source, a platen, and a carrier for handling the substrate. The carrier must be able to detect if a substrate is present. In either the case of a false detection of substrate presence or the failure to detect substrate presence, the likely result is damaged substrates, wasted polishing consumables, and down time of the manufacturing facility. Detection is achieved by the substrate causing movement of a plunger and by such movement resulting in a pressure differential that is detected. The reliability of this detection is improved by one or more of a precise relationship of the plunger to a plate that applies pressure to the substrate, a controlled seal that is ensured of being broken when the plunger is moved by the presence of a substrate, and proper spring pressure applied to the plunger to prevent spurious plunger movement.

摘要翻译： 用于抛光衬底的系统具有控制器，压力源，压板和用于处理衬底的载体。 载体必须能够检测是否存在基材。 在基板存在的错误检测或基板存在的检测失败的情况下，可能的结果是损坏基板，浪费抛光耗材和制造设备的停机时间。 通过基板实现检测，引起柱塞的移动，并通过这种移动导致检测到的压力差。 该检测的可靠性通过柱塞与向衬底施加压力的板的精确关系中的一种或多种来提高，该受控密封件确保当柱塞通过存在衬底移动时被破坏;以及 适当的弹簧压力施加到柱塞以防止假柱塞运动。

公开(公告)号：US06705924B2

公开(公告)日：2004-03-16

申请号：US10364081

申请日：2003-02-10

申请人： Sasson Somekh

发明人： Sasson Somekh

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

摘要翻译： 用于化学机械抛光系统的载体头包括基底感测机构。 承载头包括基部和连接到基部以限定室的柔性构件。 柔性构件的下表面提供衬底接收表面。 衬底检测机构包括用于测量腔室中的压力并产生代表其的输出信号的传感器，以及被配置为响应于输出信号指示衬底是否附着到衬底接收表面的处理器。

公开(公告)号：US20040033761A1

公开(公告)日：2004-02-19

申请号：US10644766

申请日：2003-08-21

发明人： Koji Ono ,  Shozo Oguri ,  Kenichi Sasabe ,  Masato Kurita ,  Yasuhisa Kojima ,  Tadanori Egawa ,  Kenichi Shigeta

IPC分类号： B24B049/00

CPC分类号： B24B37/0053 ,  B24B37/04 ,  B24B49/10 ,  B24B49/16

摘要： A polishing apparatus comprises a polishing tool, a substrate holding member, and a sensor for detecting a failure of a substrate to be polished.

摘要翻译： 抛光装置包括抛光工具，基板保持部件和用于检测待抛光的基板的故障的传感器。

公开(公告)号：US20030121890A1

公开(公告)日：2003-07-03

申请号：US10173196

申请日：2002-06-17

申请人： CALITECH CO., LTD.

发明人： Chin-Ting Kuo

IPC分类号： H01L021/302

CPC分类号： B24B37/04 ,  B24B37/0053 ,  B24B49/12 ,  H01L22/26

摘要： The present invention discloses a method and a system of wafer protection of a chemical mechanical process. It takes an image on the polishing pad, and analyzes and identifies the image. If the wafer is out of a polishing head, a signal will be sent to the chemical mechanical polishing station to respond adequately. Otherwise, repeats the image obtaining and its following analysis and identification. The present invention can avoid broken wafers and reduce the station recovery time. Hence, it can increase the up time and the throughput of the station.

摘要翻译： 本发明公开了一种化学机械工艺的晶片保护方法和系统。 它在抛光垫上拍摄图像，并分析和识别图像。 如果晶片离开抛光头，信号将被发送到化学机械抛光站以充分响应。 否则，重复图像获取及其以下分析和识别。 本发明可以避免破碎的晶片并减少站恢复时间。 因此，可以增加车站的启动时间和吞吐量。

公开(公告)号：US06328629B1

公开(公告)日：2001-12-11

申请号：US09026122

申请日：1998-02-19

申请人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

发明人： Tetsuji Togawa ,  Norio Kimura ,  Koji Ono

IPC分类号： B24B4908

CPC分类号： B24B37/30 ,  B24B37/0053 ,  B24B37/013 ,  B24B49/08 ,  B24B49/16

摘要： A workpiece such as a semiconductor wafer is held by a top ring, and a lower surface of the workpiece is polished to a flat mirror finish by being pressed against a polishing surface of the turntable while the top ring and the turntable are rotated. While the workpiece is being polished, at least one of the pressure and the flow rate of a fluid which is supplied to an upper surface of the workpiece is detected. When at least one of the detected pressure and the detected flow rate changes, the polishing of the workpiece is stopped.

摘要翻译： 诸如半导体晶片的工件由顶环保持，并且当顶环和转盘旋转时，通过被压靠在转盘的抛光表面上而将工件的下表面抛光成平坦的镜面。 当工件被抛光时，检测供给到工件的上表面的流体的压力和流速中的至少一个。 当检测到的压力和检测到的流量中的至少一个改变时，停止对工件的抛光。

公开(公告)号：US5957751A

公开(公告)日：1999-09-28

申请号：US862350

申请日：1997-05-23

申请人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

发明人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen ,  Sasson Somekh

IPC分类号： B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.