公开(公告)号：US12285838B2

公开(公告)日：2025-04-29

申请号：US18505871

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep LaRosa

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US20250114908A1

公开(公告)日：2025-04-10

申请号：US18483070

申请日：2023-10-09

Applicant: Applied Materials, Inc.

Inventor： Nai-Chieh Huang ,  Akshay Aravindan ,  Shih-Haur Shen ,  Jianshe Tang ,  Jay Gurusamy ,  Chen-Wei Chang ,  Chih-Han Yang ,  Wei Lu

IPC: B24B53/017

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

公开(公告)号：US20250108476A1

公开(公告)日：2025-04-03

申请号：US18977686

申请日：2024-12-11

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Yen-Chu Yang ,  Jianshe Tang ,  Shou-Sung Chang ,  Shih-Haur Shen ,  Taketo Sekine

IPC: B24B37/015 ,  B24B37/10 ,  B24B49/02 ,  B24B49/04 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02

Abstract: A chemical mechanical polishing system includes a support to hold a polishing pad, a carrier head to hold a substrate against the polishing pad during a polishing process, an in-situ monitoring system configured to generate a signal indicative of an amount of material on the substrate, a temperature control system to control a temperature of the polishing process, and a controller coupled to the in-situ monitoring system and the temperature control system. The controller is configured to cause the temperature control system to vary the temperature of the polishing process in response to the signal.

公开(公告)号：US12030093B2

公开(公告)日：2024-07-09

申请号：US17889330

申请日：2022-08-16

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/10 ,  B24B37/34 ,  H01L21/67

CPC classification number: B08B3/106 ,  B24B37/34 ,  H01L21/67051 ,  H01L21/67248 ,  B08B2203/007

Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

公开(公告)号：US11986926B2

公开(公告)日：2024-05-21

申请号：US17897088

申请日：2022-08-26

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

CPC classification number: B24B57/02 ,  B24B37/10 ,  H01L21/67075 ,  H01L21/6708

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

公开(公告)号：US20230415296A1

公开(公告)日：2023-12-28

申请号：US18452062

申请日：2023-08-18

Applicant: Applied Materials, Inc.

Inventor： Shou-Sung Chang ,  Hari Soundararajan ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.

公开(公告)号：US11633833B2

公开(公告)日：2023-04-25

申请号：US16886238

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher

IPC: B24B53/017 ,  B24B53/00 ,  B24B57/02 ,  B24B41/06

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

公开(公告)号：US11628478B2

公开(公告)日：2023-04-18

申请号：US16886567

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Jianshe Tang ,  Hari Soundararajan ,  Shou-Sung Chang ,  Hui Chen ,  Chih Chung Chou ,  Alexander John Fisher ,  Paul D. Butterfield

IPC: B08B3/00 ,  B08B3/10 ,  H01L21/02 ,  B08B1/00 ,  B24B53/017 ,  B24B37/20 ,  H01L21/306

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

公开(公告)号：US11597052B2

公开(公告)日：2023-03-07

申请号：US16448980

申请日：2019-06-21

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang ,  Jeonghoon Oh ,  Rajeev Bajaj ,  Andrew Siordia

IPC: B24B49/00 ,  B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B37/27 ,  G05D23/24

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.

公开(公告)号：US20230054165A1

公开(公告)日：2023-02-23

申请号：US17405898

申请日：2021-08-18

Applicant: Applied Materials, Inc.

Inventor： Chih Chung Chou ,  Haosheng Wu ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Chad Pollard ,  Hari N. Soundararajan

IPC: B24B37/34 ,  H01L21/306 ,  H01L21/66 ,  B06B1/06 ,  B01F11/02 ,  B01F15/06

Abstract: Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assemblies may include one or more ultrasonic transducers coupled with the deagglomeration tube.