公开(公告)号：US20210395877A1

公开(公告)日：2021-12-23

申请号：US16908344

申请日：2020-06-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Keith A. MILLER ,  Srinivasa Rao YEDLA ,  Chandrashekar KENCHAPPA ,  Martin Lee RIKER

IPC: C23C14/34

Abstract: Embodiments of process kits for use in plasma process chambers are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular body having an upper portion and a lower portion extending downward and radially inward from the upper portion, wherein the annular body includes an inner surface having a first segment that extends downward, a second segment that extends radially outward from the first segment, a third segment that extends downward from the second segment, a fourth segment that extends radially outward from the third segment, a fifth segment that extends downward from the fourth segment, a sixth segment that extends radially inward from the fifth segment, a seventh segment that extends downward from the sixth segment, and an eighth segment that extends radially inward from the seventh segment.