公开(公告)号：US20190326096A1

公开(公告)日：2019-10-24

申请号：US15958569

申请日：2018-04-20

Applicant: APPLIED MATERIALS, INC.

Inventor： PHILIP ALLAN KRAUS ,  THAI CHENG CHUA ,  CHRISTIAN AMORMINO ,  DMITRY A. DZILNO

IPC: H01J37/32 ,  H01Q3/34 ,  H03B5/24 ,  H01Q21/00

Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.