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公开(公告)号：US20240186118A1
公开(公告)日：2024-06-06
申请号：US18419389
申请日：2024-01-22
Applicant: Applied Materials, Inc.
Inventor： JAMES CARDUCCI , RICHARD C. FOVELL , LARRY D. ELIZAGA , SILVERST RODRIGUES , VLADIMIR KNYAZIK , PHILIP ALLAN KRAUS , THAI CHENG CHUA
IPC: H01J37/32 , C23C16/455 , C23C16/511
CPC classification number: H01J37/3244 , C23C16/45559 , C23C16/45561 , C23C16/511 , H01J2237/3321 , H01J2237/334 , H01J2237/335
Abstract: Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.
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公开(公告)号：US20190326096A1
公开(公告)日：2019-10-24
申请号：US15958569
申请日：2018-04-20
Applicant: APPLIED MATERIALS, INC.
Inventor： PHILIP ALLAN KRAUS , THAI CHENG CHUA , CHRISTIAN AMORMINO , DMITRY A. DZILNO
Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.
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