公开(公告)号：US20190326152A1

公开(公告)日：2019-10-24

申请号：US16388308

申请日：2019-04-18

Applicant: APPLIED MATERIALS, INC.

Inventor： CHANG KE ,  BONNIE CHIA ,  SONG-MOON SUH ,  CHENG-HSIUNG TSAI ,  YUANHONG GUO ,  LEI ZHOU ,  DAVID LANGTRY

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/455

Abstract: Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.