公开(公告)号：US20160020134A1

公开(公告)日：2016-01-21

申请号：US14752245

申请日：2015-06-26

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KIRANKUMAR SAVANDAIAH ,  CHENG-HSIUNG TSAI ,  KAI LIANG LIEW

IPC: H01L21/687 ,  H01L21/02 ,  C23C14/50 ,  C23C16/50 ,  C23C16/455 ,  C23C16/458 ,  H01L21/306 ,  H01J37/32

CPC classification number: H01L21/67069 ,  C23C14/50 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32009 ,  H01J37/32082 ,  H01J37/32577 ,  H01J37/3405 ,  H01J2237/3321 ,  H01J2237/334 ,  H01L21/306 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01L21/68757

Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.

Abstract translation: 本文公开了用于处理基底的方法和装置。 在一些实施例中，用于处理衬底的设备包括：衬底支撑件，其具有包括电绝缘涂层的衬底支撑表面; 基板升降机构，其包括多个提升销，所述多个提升销构造成在布置在所述基板支撑表面下方的第一位置和设置在所述基板支撑表面之上的第二位置之间移动 以及连接器，被配置为在所述多个提升销到达所述基板支撑表面的平面之前，选择性地在所述基板支撑件和所述基板升降机构之间提供电连接。

公开(公告)号：US20210057244A1

公开(公告)日：2021-02-25

申请号：US16545537

申请日：2019-08-20

Applicant: APPLIED MATERIALS, INC.

Inventor： VINODH RAMACHANDRAN ,  ANANTHKRISHNA JUPUDI ,  CHENG-HSIUNG TSAI ,  YUEH SHENG OW ,  PREETHAM P. RAO ,  RIBHU GAUTAM ,  PRASHANT AGARWAL

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/66 ,  H05B6/64

Abstract: Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.

公开(公告)号：US20200378006A1

公开(公告)日：2020-12-03

申请号：US16424302

申请日：2019-05-28

Applicant: APPLIED MATERIALS, INC.

Inventor： RIBHU GAUTAM ,  ANANTHKRISHNA JUPUDI ,  TUCK FOONG KOH ,  PREETHAM P. RAO ,  VINODH RAMACHANDRAN ,  YUEH SHENG OW ,  YUICHI WADA ,  CHENG-HSIUNG TSAI ,  KAI LIANG LIEW

IPC: C23C16/511 ,  C23C16/54 ,  B01J19/12

Abstract: Methods and apparatus for a substrate processing chamber are provided herein. In some embodiments, a substrate processing chamber includes a chamber body having sidewalls defining an interior volume having a polygon shape; a selectively sealable elongated opening disposed in an upper portion of the chamber body for transferring one or more substrates into or out of the chamber body; a funnel disposed at a first end of the chamber body, wherein the funnel increases in size along a direction from an outer surface of the chamber body to the interior volume; and a pump port disposed at a second end of the chamber body opposite the funnel.

公开(公告)号：US20190326152A1

公开(公告)日：2019-10-24

申请号：US16388308

申请日：2019-04-18

Applicant: APPLIED MATERIALS, INC.

Inventor： CHANG KE ,  BONNIE CHIA ,  SONG-MOON SUH ,  CHENG-HSIUNG TSAI ,  YUANHONG GUO ,  LEI ZHOU ,  DAVID LANGTRY

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/455

Abstract: Methods and apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support to support a substrate having a given diameter includes: a base ring having an inner diameter less than the given diameter, the base ring having a support surface configured to contact a first surface of the substrate and to form a seal between the support surface and the first surface of the substrate, when disposed atop the base ring; and a clamp ring having an inner diameter less than the given diameter, wherein the clamp ring includes a contact surface proximate the inner diameter configured to contact an upper surface of the substrate, when present, and wherein the clamp ring and the base ring are further configured to provide a bias force toward each other to clamp the substrate in the substrate support.

公开(公告)号：US20180233396A1

公开(公告)日：2018-08-16

申请号：US15468509

申请日：2017-03-24

Applicant: APPLIED MATERIALS, INC.

Inventor： TOMOHARU MATSUSHITA ,  ARAVIND KAMATH ,  JALLEPALLY RAVI ,  CHENG-HSIUNG TSAI ,  HIROYUKI TAKAHAMA

IPC: H01L21/683 ,  H01L21/68 ,  G01L21/00

CPC classification number: H01L21/6838 ,  G01L21/02 ,  H01L21/67253

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US20160258061A1

公开(公告)日：2016-09-08

申请号：US14641378

申请日：2015-03-07

Applicant: APPLIED MATERIALS, INC.

Inventor： CHENG-HSIUNG TSAI ,  YOUQUN DONG ,  MANJUNATHA KOPPA

IPC: C23C16/458

Abstract: Apparatus for improving substrate temperature uniformity in a substrate processing chamber are provided herein. In some embodiments, a cover plate for a substrate processing chamber includes: an outer portion; and a raised inner portion having a thermally emissive layer, wherein a thermal emissivity of the thermally emissive layer varies across the thermally emissive layer.

Abstract translation: 本发明提供用于提高基板处理室中的基板温度均匀性的装置。 在一些实施例中，用于基板处理室的盖板包括：外部部分; 以及具有热发射层的升高的内部部分，其中热发射层的热辐射率在热发射层上变化。

公开(公告)号：US20200185247A1

公开(公告)日：2020-06-11

申请号：US16213816

申请日：2018-12-07

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T CHIA ,  ROSS MARSHALL ,  TOMOHARU MATSUSHITA ,  CHENG-HSIUNG TSAI

IPC: H01L21/683 ,  H01L21/67

Abstract: Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.

公开(公告)号：US20190326154A1

公开(公告)日：2019-10-24

申请号：US16383772

申请日：2019-04-15

Applicant: APPLIED MATERIALS, INC.

Inventor： CHENG-HSIUNG TSAI ,  ANANTHKRISHNA JUPUDI ,  SARATH BABU

IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  C23C14/50

Abstract: Two-piece shutter disk assemblies for use in process chambers are provided herein. In some embodiments, a shutter disk assembly for use in a process chamber includes an upper disk member having a top surface and a bottom surface, wherein a central alignment recess is formed in a center of the bottom surface, and a lower carrier member having a solid base having an upper support surface, wherein the upper support surface includes a first central self-centering feature disposed in the recess formed in the center of the bottom surface and an annular outer alignment feature that protrudes upward from a top surface of the lower carrier and forms a pocket, wherein the upper disk member is disposed in the pocket.

公开(公告)号：US20190316251A1

公开(公告)日：2019-10-17

申请号：US15950726

申请日：2018-04-11

Applicant: APPLIED MATERIALS, INC.

Inventor： CHENG-HSIUNG TSAI ,  ANANTHKRISHNA JUPUDI ,  EIJI ASAHINA ,  SARATH BABU

IPC: C23C14/52 ,  C23C14/56 ,  C23C14/54 ,  C23C14/02

Abstract: Methods and apparatus for detecting a shutter disk assembly in a process chamber using a number of sensors. A first, second, and third sensor in a shutter housing for a shutter disk assembly provide indications of a status of the shutter disk assembly. The indications are used in part to determine the operational status of the shutter disk assembly along with process information from a process controller. The operational status is then used to alter a process of the process chamber when necessary.

公开(公告)号：US20170186631A1

公开(公告)日：2017-06-29

申请号：US15457981

申请日：2017-03-13

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  KIRANKUMAR SAVANDAIAH ,  CHENG-HSIUNG TSAI ,  KAI LIANG LIEW

IPC: H01L21/67 ,  H01L21/683 ,  C23C16/50 ,  C23C14/50 ,  C23C16/458 ,  H01L21/687 ,  H01J37/32

CPC classification number: H01L21/67069 ,  C23C14/50 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32009 ,  H01J37/32082 ,  H01J37/32577 ,  H01J37/3405 ,  H01J2237/3321 ,  H01J2237/334 ,  H01L21/306 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01L21/68757

Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.