公开(公告)号：US20200211883A1

公开(公告)日：2020-07-02

申请号：US16286273

申请日：2019-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ARVIND SUNDARRAJAN ,  KARRTHIK PARATHITHASAN ,  QI JIE PENG ,  MANORAJH ARUNAKIRI

IPC: H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.