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公开(公告)号：US20190326147A1
公开(公告)日：2019-10-24
申请号：US16432568
申请日：2019-06-05
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ENG SHENG PEH , SRINIVAS D. NEMANI , ARVIND SUNDARRAJAN , AVINASH AVULA , ELLIE Y. YIEH , MICHAEL RICE , GINETTO ADDIEGO
IPC: H01L21/673 , B25J11/00
Abstract: Embodiments of a multi-cassette carrying case are provided herein. In some embodiments a method for transporting a substrate from a first processing device to a second processing device includes docking a substrate cassette to a first chamber; pumping down pressure in the substrate cassette; transferring a substrate through the first chamber to the substrate cassette; sealing the substrate cassette and moving the substrate cassette having the substrate disposed therein from the first chamber to a second chamber; docking the substrate cassette to the second chamber; and transferring the substrate from the substrate cassette through the second chamber.
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公开(公告)号：US20180257116A1
公开(公告)日：2018-09-13
申请号：US15974000
申请日：2018-05-08
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , JEN SERN LEW , ARVIND SUNDARRAJAN , SRINIVAS NEMANI
IPC: B08B5/02 , H01L21/67 , H01L21/683 , B08B6/00
CPC classification number: B08B5/02 , B08B6/00 , H01L21/67028 , H01L21/6831 , H01L21/6838
Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.
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公开(公告)号：US20190326146A1
公开(公告)日：2019-10-24
申请号：US16432590
申请日：2019-06-05
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ENG SHENG PEH , SRINIVAS D. NEMANI , ARVIND SUNDARRAJAN , AVINASH AVULA , ELLIE Y. YIEH
IPC: H01L21/673 , H01L21/67 , H01L21/677
Abstract: Embodiments of substrate transfer apparatus are provided herein. In some embodiments, an apparatus for storing and transporting at least one substrate in a vacuum includes a carrying case for storing one or more substrates, wherein the carrying case includes a vacuum port and a plurality of holders to hold one or more substrates within an inner volume of the carrying case; and a vacuum source in fluid connection with the carrying case via the vacuum port.
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公开(公告)号：US20160133490A1
公开(公告)日：2016-05-12
申请号：US14933628
申请日：2015-11-05
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ENG SHENG PEH , SRINIVAS D. NEMANI , ARVIND SUNDARRAJAN , AVINASH AVULA , ELLIE Y. YIEH
IPC: H01L21/673 , H01L21/677
CPC classification number: H01L21/67373 , H01L21/67201 , H01L21/67369 , H01L21/67376 , H01L21/67379
Abstract: Embodiments method and apparatus for transferring a substrate are provided herein. In some embodiments, a substrate cassette includes a body having an upper portion and a lower portion, the upper portion and the lower portion defining an interior volume when the upper portion is coupled to the lower portion; a locking mechanism moveable between a locked position, in which the upper and lower portions are coupled, and an unlocked position, in which the lower portion can be separated from the upper portion; and a load distribution plate coupled to an upper surface of the upper portion along an edge of the upper portion to distribute a load applied to the load distribution plate.
Abstract translation: 本发明提供了用于转移基板的实施例的方法和装置。 在一些实施例中，衬底盒包括具有上部和下部的主体，当上部联接到下部时，上部和下部限定内部容积; 锁定机构，其能够在上部和下部结合的锁定位置和解锁位置之间移动，其中下部可以与上部分离; 以及负载分配板，其沿着所述上部的边缘联接到所述上部的上表面，以分配施加到所述负载分配板的负载。
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公开(公告)号：US20200211883A1
公开(公告)日：2020-07-02
申请号：US16286273
申请日：2019-02-26
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ARVIND SUNDARRAJAN , KARRTHIK PARATHITHASAN , QI JIE PENG , MANORAJH ARUNAKIRI
IPC: H01L21/683 , H01L21/48 , H01L21/56
Abstract: Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.
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Patent Agency Ranking
公开(公告)号：US20160151808A1
公开(公告)日：2016-06-02
申请号：US14556085
申请日：2014-11-28
Applicant: APPLIED MATERIALS, INC.
CPC classification number: B08B5/02 , B08B6/00 , H01L21/67028 , H01L21/6831 , H01L21/6838
Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.
Abstract translation: 本文提供了用于从衬底的表面（例如从衬底的背面）去除颗粒的方法和设备的实施例。 在一些实施例中，用于从衬底的表面去除颗粒的设备包括：衬底处理器，用于暴露衬底的表面; 颗粒分离器，用于从基板的暴露表面分离颗粒; 用于输送分离的颗粒的颗粒转运体; 和用于收集被输送的颗粒的颗粒收集器。
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公开(公告)号：US20210057238A1
公开(公告)日：2021-02-25
申请号：US16545752
申请日：2019-08-20
Applicant: APPLIED MATERIALS, INC.
Inventor： CHIN WEI TAN , QI JIE PENG , FANG JIE LIM , PRAYUDI LIANTO , SRISKANTHARAJAH THIRUNAVUKARASU , ARVIND SUNDARRAJAN , JUN-LIANG SU
IPC: H01L21/67 , H01L21/683 , H01L21/687
Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; subsequently constraining the substrate with a clamping force exerted towards the substrate from a top direction by applying a high pressure gas to the substrate and from a bottom direction by applying a vacuum pressure to the substrate; and rapidly cooling the substrate while the substrate is constrained.
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公开(公告)号：US20200306931A1
公开(公告)日：2020-10-01
申请号：US16363009
申请日：2019-03-25
Applicant: APPLIED MATERIALS, INC.
Inventor： PRAYUDI LIANTO , PENG SUO , SHIH-CHAO HUNG , PIN GIAN GAN , CHUN YU TO , PERIYA GOPALAN , KOK SEONG TEO , LIT PING LAM , ANDY LOO , PANGYEN ONG , DAVID P. SURDOCK , KEITH YPMA , BRIAN WILLIAMS , SCOTT OSTERMAN , MARVIN L. BERNT , MUHAMMAD NORHAZWAN , SAMUEL GOPINATH , MUHAMMAD AZIM , GUAN HUEI SEE , QI JIE PENG , SRISKANTHARAJAH THIRUNAVUKARASU , ARVIND SUNDARRAJAN
Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.
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公开(公告)号：US20160133494A1
公开(公告)日：2016-05-12
申请号：US14933635
申请日：2015-11-05
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ENG SHENG PEH , SRINIVAS D. NEMANI , ARVIND SUNDARRAJAN , AVINASH AVULA , ELLIE Y. YIEH
IPC: H01L21/677 , H01L21/673 , B25J11/00
CPC classification number: H01L21/67778 , H01L21/67201 , H01L21/67369 , H01L21/67373 , H01L21/67379 , H01L21/67389
Abstract: Embodiments of substrate transfer chambers are provided herein. In some embodiments, a substrate transfer chamber includes a body having an interior volume, wherein a bottom portion of the body includes a first opening; an adapter plate coupled to the bottom portion of the body to couple the substrate transfer chamber to a load lock chamber of a substrate processing system; wherein the adapter plate includes a second opening aligned with the first opening to fluidly couple the interior volume with an inner volume of the load lock chamber; a cassette support disposed in the interior volume to support a substrate cassette; and a lift actuator coupled to the cassette support to lower or raise the substrate cassette into or out of the load lock chamber.
Abstract translation: 本文提供了基板传送室的实施例。 在一些实施例中，衬底传送室包括具有内部容积的主体，其中主体的底部包括第一开口; 耦合到所述主体的底部的适配器板，以将所述衬底传送室耦合到衬底处理系统的负载锁定室; 其中所述适配器板包括与所述第一开口对准的第二开口，以将所述内部容积与所述负载锁定室的内部容积流体连接; 设置在所述内部容积中以支撑衬底盒的盒支架; 以及联接到所述盒支撑件的升降致动器，以将所述基板盒降低或升高到所述负载锁定室中或从所述负载锁定室中升起。
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公开(公告)号：US20160133491A1
公开(公告)日：2016-05-12
申请号：US14933651
申请日：2015-11-05
Applicant: APPLIED MATERIALS, INC.
Inventor： SRISKANTHARAJAH THIRUNAVUKARASU , ENG SHENG PEH , SRINIVAS D. NEMANI , ARVIND SUNDARRAJAN , AVINASH AVULA , ELLIE Y. YIEH , MICHAEL RICE , GINETTO ADDIEGO
IPC: H01L21/673 , B25J11/00
Abstract: Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a door coupled to the body to selectively seal off the inner volume; and a plurality of cassette holders disposed in the inner volume to hold one or more substrate cassettes. In some embodiments, a method of transferring substrates includes: placing a substrate in a substrate cassette, wherein an inner volume of the substrate cassette is sealed from an environment outside of the substrate cassette; and placing the substrate cassette in a multi-cassette carrying case.
Abstract translation: 这里提供了多盒式携带箱的实施例。 在一些实施例中，多卡带手提箱包括：具有内部容积的主体; 一个门连接到主体以选择性地密封内部容积; 以及设置在所述内部容积中以容纳一个或多个衬底盒的多个盒座。 在一些实施例中，传送衬底的方法包括：将衬底放置在衬底盒中，其中衬底盒的内部体积与衬底盒外的环境密封; 并将衬底盒放置在多盒式手提箱中。
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