公开(公告)号：US20180151325A1

公开(公告)日：2018-05-31

申请号：US15823176

申请日：2017-11-27

Applicant: APPLIED MATERIALS, INC.

Inventor： ADOLPH MILLER ALLEN ,  WILLIAM JOHANSON ,  VIACHSLAV BABAYAN ,  ZHONG QIANG HUA ,  CARL R. JOHNSON ,  VANESSA FAUNE ,  JINGJING LIU ,  VAIBHAV SONI ,  KIRANKUMAR SAVANDAIAH ,  SUNDARAPANDIAN RAMALINGA VIJAYALAKS REDDY

IPC: H01J37/02 ,  C23C14/34

CPC classification number: H01J37/026 ,  C23C14/34 ,  C23C14/351 ,  C23C14/564 ,  H01J37/32477 ,  H01J37/32642 ,  H01J37/32651

Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.