公开(公告)号：US20040134775A1

公开(公告)日：2004-07-15

申请号：US10627336

申请日：2003-07-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael X. Yang ,  Dmitry Lubomirsky ,  Yezdi N. Dordi ,  Saravjeet Sinh ,  Sheshraj L. Tulshibagwale ,  Nicolay Y. Kovarsky

IPC: C25C007/04

CPC classification number: A23D7/01 ,  A23D7/00 ,  A23D7/005 ,  A23J7/00 ,  C07F9/103 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885

Abstract: Embodiments of the invention provide an electrochemical plating cell. The plating cell includes a fluid basin having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane positioned between the anolyte solution compartment and the catholyte solution compartment, and an anode positioned in the anolyte solution compartment, wherein the ionic membrane comprises a poly tetrafluoroethylene based ionomer.

Abstract translation: 本发明的实施方案提供一种电化学电镀单元。 电镀槽包括具有阳极电解液隔室和阴极电解液溶液隔室的流体池，位于阳极电解液室和阴极电解液溶液室之间的离子膜和位于阳极电解液溶液室中的阳极，其中离子膜包含聚 四氟乙烯基离聚物。