公开(公告)号：US20180103508A1

公开(公告)日：2018-04-12

申请号：US15840759

申请日：2017-12-13

Applicant: APPLIED MATERIALS, INC.

Inventor： ALEXANDER MATYUSHKIN ,  DAN KATZ ,  JOHN HOLLAND ,  THEODOROS PANAGOPOULOS ,  MICHAEL D. WILLWERTH

IPC: H05B3/00 ,  H01L21/683

CPC classification number: H05B3/0047 ,  B05C13/00 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/6833

Abstract: A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.