公开(公告)号：US20220341867A1

公开(公告)日：2022-10-27

申请号：US17861034

申请日：2022-07-08

Applicant: Applied Materials, Inc.

Inventor： YAOLING PAN ,  PATRICK JOHN TAE ,  LEONARD TEDESCHI ,  MICHAEL D. WILLWERTH ,  DANIEL THOMAS MCCORMICK

IPC: G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US20210035851A1

公开(公告)日：2021-02-04

申请号：US16526840

申请日：2019-07-30

Applicant: APPLIED MATERIALS, INC.

Inventor： CHANGHUN LEE ,  MICHAEL D. WILLWERTH ,  JEFFREY LUDWIG

IPC: H01L21/687 ,  H01L21/67

Abstract: Embodiments of a substrate support for use in a processing chamber are provided herein. In some embodiments, a substrate support includes a pedestal having an upper surface configured to accommodate a lift pin, a first annular region near an edge of the pedestal, and a second annular region disposed between the first annular region and a center of the pedestal, wherein the pedestal includes a first plurality of holes extending from the upper surface at regular intervals along the first annular region and a second plurality of holes extending from the upper surface at regular intervals along the second annular region; and a non-metal ball comprising aluminum oxide disposed in each hole of the first plurality of holes and the second plurality of holes, wherein an upper surface of each of the non-metal balls is raised with respect to the upper surface of the pedestal to define a support surface.

公开(公告)号：US20140151331A1

公开(公告)日：2014-06-05

申请号：US13778252

申请日：2013-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： VALENTIN N. TODOROW ,  MICHAEL D. WILLWERTH ,  YING-SHENG LIN ,  DAVID PALAGASHVILI

IPC: H01J37/32

CPC classification number: H01J37/321 ,  H01J37/32477 ,  H01J37/32651

Abstract: Methods and apparatus for plasma processing of substrates are provided herein. In some embodiments, a deposition shield for use in processing a substrate having a given width may include a first plate having a first plurality of holes disposed through a thickness of the first plate; and a second plate disposed below the first plate and having a second plurality of holes disposed through a thickness of the second plate, wherein individual holes in the first plurality of holes and the second plurality of holes are not aligned.

Abstract translation: 本文提供了基板等离子体处理的方法和装置。 在一些实施例中，用于处理具有给定宽度的衬底的沉积屏蔽可以包括具有穿过第一板的厚度设置的第一多个孔的第一板; 以及第二板，其设置在所述第一板的下方，并且具有穿过所述第二板的厚度设置的第二多个孔，其中所述第一多个孔中的各个孔和所述第二多个孔不对准。

公开(公告)号：US20180103508A1

公开(公告)日：2018-04-12

申请号：US15840759

申请日：2017-12-13

Applicant: APPLIED MATERIALS, INC.

Inventor： ALEXANDER MATYUSHKIN ,  DAN KATZ ,  JOHN HOLLAND ,  THEODOROS PANAGOPOULOS ,  MICHAEL D. WILLWERTH

IPC: H05B3/00 ,  H01L21/683

CPC classification number: H05B3/0047 ,  B05C13/00 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/6833

Abstract: A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.