公开(公告)号：US20160225656A1

公开(公告)日：2016-08-04

申请号：US14613081

申请日：2015-02-03

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Mario David Silvetti ,  Randy A. Harris ,  Bryan Puch ,  Vincent Steffan Francischetti ,  Satish Sundar

IPC: H01L21/687 ,  H01L21/677 ,  B08B3/10

CPC classification number: H01L21/67751 ,  B08B3/02 ,  B08B2203/0229 ,  H01L21/68721

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract translation: 晶片处理系统具有用于将晶片装载到卡盘组件中的环维护模块，以及用于清洁和检查在系统的电镀处理器中使用的卡盘组件。 轴连接到转子板上。 旋转马达使轴和转子板旋转在轴上。 在轴的上端上的卡盘夹将卡盘组件保持在转子板上。 升降马达提升和降低转子板和轴，以移动打开用于晶片装载和卸载的卡盘组件，并将卡盘组件移动到不同的加工位置。 可以提供具有喷嘴的摆臂来清洁卡盘组件。

公开(公告)号：US09812344B2

公开(公告)日：2017-11-07

申请号：US14613081

申请日：2015-02-03

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Mario David Silvetti ,  Randy A. Harris ,  Bryan Puch ,  Vincent Steffan Francischetti ,  Satish Sundar

IPC: H01L21/00 ,  H01L21/677 ,  B08B3/02 ,  H01L21/687

CPC classification number: H01L21/67751 ,  B08B3/02 ,  B08B2203/0229 ,  H01L21/68721

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.