公开(公告)号：US20160240405A1

公开(公告)日：2016-08-18

申请号：US14620420

申请日：2015-02-12

Applicant: APPLIED Materials, Inc.

Inventor： Vincent Steffan Francischetti ,  Robert B. Moore ,  Mario David Silvetti ,  Roey Shaviv

IPC: H01L21/67 ,  H01L21/677 ,  B25J11/00

CPC classification number: H01L21/67017 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67769 ,  H01L21/68707

Abstract: A high throughput stand-alone anneal system has a horizontal row of docking stations at a front wall of an enclosure. A rack in the enclosure has a plurality of vertically stacked anneal modules. Robots within the enclosure move wafers from the docking stations to one of the anneal modules for rapid thermal anneal processing.

Abstract translation: 高通量的独立退火系统在外壳的前壁上具有一排水平的对接站。 机壳中的机架具有多个垂直堆叠的退火模块。 外壳内的机器人将晶片从对接站移动到退火模块之一，用于快速热退火处理。

公开(公告)号：US09812344B2

公开(公告)日：2017-11-07

申请号：US14613081

申请日：2015-02-03

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Mario David Silvetti ,  Randy A. Harris ,  Bryan Puch ,  Vincent Steffan Francischetti ,  Satish Sundar

IPC: H01L21/00 ,  H01L21/677 ,  B08B3/02 ,  H01L21/687

CPC classification number: H01L21/67751 ,  B08B3/02 ,  B08B2203/0229 ,  H01L21/68721

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

公开(公告)号：US20180304441A1

公开(公告)日：2018-10-25

申请号：US16017689

申请日：2018-06-25

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B41/06 ,  B24B37/32

CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

公开(公告)号：US20160225656A1

公开(公告)日：2016-08-04

申请号：US14613081

申请日：2015-02-03

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Mario David Silvetti ,  Randy A. Harris ,  Bryan Puch ,  Vincent Steffan Francischetti ,  Satish Sundar

IPC: H01L21/687 ,  H01L21/677 ,  B08B3/10

CPC classification number: H01L21/67751 ,  B08B3/02 ,  B08B2203/0229 ,  H01L21/68721

Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Abstract translation: 晶片处理系统具有用于将晶片装载到卡盘组件中的环维护模块，以及用于清洁和检查在系统的电镀处理器中使用的卡盘组件。 轴连接到转子板上。 旋转马达使轴和转子板旋转在轴上。 在轴的上端上的卡盘夹将卡盘组件保持在转子板上。 升降马达提升和降低转子板和轴，以移动打开用于晶片装载和卸载的卡盘组件，并将卡盘组件移动到不同的加工位置。 可以提供具有喷嘴的摆臂来清洁卡盘组件。

公开(公告)号：US11173579B2

公开(公告)日：2021-11-16

申请号：US16017689

申请日：2018-06-25

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B41/06 ,  B24B37/32

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.