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    WAFER PROCESSING SYSTEM WITH CHUCK ASSEMBLY MAINTENANCE MODULE
    2.
    发明申请
    WAFER PROCESSING SYSTEM WITH CHUCK ASSEMBLY MAINTENANCE MODULE 有权
    具有卡盘组件维护模块的加热系统

    公开(公告)号：US20160225656A1

    公开(公告)日：2016-08-04

    申请号：US14613081

    申请日：2015-02-03

    Applicant: APPLIED Materials, Inc.

    Inventor： Jason Rye ,  Mario David Silvetti ,  Randy A. Harris ,  Bryan Puch ,  Vincent Steffan Francischetti ,  Satish Sundar

    IPC: H01L21/687 ,  H01L21/677 ,  B08B3/10

    CPC classification number: H01L21/67751 ,  B08B3/02 ,  B08B2203/0229 ,  H01L21/68721

    Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

    Abstract translation: 晶片处理系统具有用于将晶片装载到卡盘组件中的环维护模块，以及用于清洁和检查在系统的电镀处理器中使用的卡盘组件。 轴连接到转子板上。 旋转马达使轴和转子板旋转在轴上。 在轴的上端上的卡盘夹将卡盘组件保持在转子板上。 升降马达提升和降低转子板和轴，以移动打开用于晶片装载和卸载的卡盘组件，并将卡盘组件移动到不同的加工位置。 可以提供具有喷嘴的摆臂来清洁卡盘组件。

    Anneal module for semiconductor wafers
    4.
    发明授权
    Anneal module for semiconductor wafers 有权
    用于半导体晶片的退火模块

    公开(公告)号：US09245767B2

    公开(公告)日：2016-01-26

    申请号：US14025678

    申请日：2013-09-12

    Applicant: APPLIED Materials, Inc.

    Inventor： Vincent Steffan Francischetti ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Paul Wirth ,  Robert B. Moore

    IPC: H05B3/68 ,  F26B19/00 ,  H01L21/324 ,  H01L21/67 ,  H01L21/677

    CPC classification number: H01L21/324 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

    Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

    Abstract translation: 用于退火半导体材料晶片和类似衬底的退火模块减少了颗粒污染和氧气进入，同时提供包括500℃工艺的均匀加热。 退火模块可以包括形成在具有内部冷却线的金属体中的处理室。 热板具有支撑在身体上的热扼流圈上的基座。 热板上的盖子中的气体分布器将气体均匀地流过晶片。 传送机构移动环以在热板和冷板之间移动晶片。

    VACUUM PRE-WETTING APPARATUS AND METHODS
    6.
    发明申请
    VACUUM PRE-WETTING APPARATUS AND METHODS 有权
    真空预湿装置和方法

    公开(公告)号：US20160102397A1

    公开(公告)日：2016-04-14

    申请号：US14509784

    申请日：2014-10-08

    Applicant: APPLIED Materials, Inc.

    Inventor： Robert B. Moore ,  Vincent Steffan Francischetti

    IPC: C23C16/02 ,  C23C16/44

    CPC classification number: C23C16/0227 ,  C23C16/44 ,  C23C18/1619 ,  C23C18/163 ,  C23C18/1803 ,  C23C18/1851 ,  C25D5/34 ,  C25D17/001 ,  C25D17/06

    Abstract: A processing apparatus may include a down-facing substrate processing chamber fixed at acute angle to horizontal. A chuck plate on a platform may pivot from an open position wherein the platform is at an acute angle to the processing chamber, to a parallel position wherein the platform is parallel to the processing chamber. The chuck plate may then be moved linearly into sealing engagement with the processing chamber. A chuck holder may be provided on the platform to hold the chuck in place.

    Abstract translation: 处理装置可以包括与水平面成锐角固定的向下的衬底处理室。 平台上的卡盘可以从平台处于与处理室成锐角的打开位置枢转到平台位置，其中平台平行于处理室。 然后可以将卡盘板线性地移动到与处理室密封接合。 可以在平台上设置卡盘保持器以将卡盘保持在适当位置。

    ANNEAL MODULE FOR SEMICONDUCTOR WAFERS
    7.
    发明申请
    ANNEAL MODULE FOR SEMICONDUCTOR WAFERS 有权
    用于半导体波形的天线模块

    公开(公告)号：US20150069043A1

    公开(公告)日：2015-03-12

    申请号：US14025678

    申请日：2013-09-12

    Applicant: APPLIED Materials, Inc.

    Inventor： Vincent Steffan Francischetti ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Paul Wirth ,  Robert B. Moore

    IPC: H01L21/324 ,  H01L21/677 ,  H01L21/67

    CPC classification number: H01L21/324 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

    Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

    Abstract translation: 用于退火半导体材料晶片和类似衬底的退火模块减少了颗粒污染和氧气进入，同时提供包括500℃工艺的均匀加热。 退火模块可以包括形成在具有内部冷却线的金属体中的处理室。 热板具有支撑在身体上的热扼流圈上的基座。 热板上的盖子中的气体分布器将气体均匀地流过晶片。 传送机构移动环以在热板和冷板之间移动晶片。

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