BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE
    4.
    发明申请
    BASE RESIN FOR SOLDERING FLUX, SOLDERING FLUX AND SOLDER PASTE 审中-公开
    用于焊接焊剂,焊接焊剂和焊膏的基材树脂

    公开(公告)号:US20150075676A1

    公开(公告)日:2015-03-19

    申请号:US14390207

    申请日:2013-05-13

    摘要: The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3).

    摘要翻译: 本发明的目的是提供一种提高助焊剂的流动性的助焊剂取向的新型基础树脂,同时提高焊膏的粘度稳定性和粘合性,同时提高色调和抗裂纹性 助焊剂残留。 本发明涉及一种用于助焊剂的基础树脂,该基础树脂包含含有至少15重量%的异丙酚型树脂酸(a-1)的松香(A),至少1重量%的乳白烷 型树脂酸(a-2)和至少50重量%的不含共轭双键的一种戊二醇型树脂酸(a-3)。