公开(公告)号：US20020173594A1

公开(公告)日：2002-11-21

申请号：US10093079

申请日：2002-03-07

Applicant: ARCH SPECIALTY CHEMICALS, INC.

Inventor： Binod B. De ,  Sanjay Malik ,  Gregory Spaziano ,  John Joseph Biafore ,  Patrick Foster ,  Sidney George Slater ,  Thomas Steinhausler ,  Andrew J. Blakeney

IPC: C08L029/02

CPC classification number: G03F7/11 ,  C09D133/14

Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1 wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or c6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the nullnullR4Onullnullp; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Abstract translation: 包含含羟基聚合物，氨基交联剂和热酸发生剂的热固化组合物的光刻用热固化底涂层，其中含羟基聚合物是包含下式的单元m，n和o的聚合物 其中R1是H或甲基; R2是取代或未取代的C6-C14芳基丙烯酸酯或C6-C14芳基甲基丙烯酸酯基，其中取代基可以是苯基，C 1-4烷基或C 1-4烷氧基; R3是丙烯酸羟基官能化的C1-C8烷基酯，甲基丙烯酸酯或c6-C14芳基，R4是C1-C10直链或支链亚烷基; p是1至5的整数，条件是在[-R4O-] p中不超过三十个碳原子; R5是C1-C10直链，支链或环状烷基，取代或未取代的C6-C14芳基或取代或未取代的C7-C15脂环族烃; m为约40至70，n为约15至35，o为约15至25。

公开(公告)号：US20040137362A1

公开(公告)日：2004-07-15

申请号：US10699298

申请日：2003-10-31

Applicant: ARCH SPECIALTY CHEMICALS, INC.

Inventor： Binod B. De ,  Sanjay Malik ,  Stephanie J. Dilocker ,  Ognian N. Dimov

IPC: G03C001/73 ,  G03F007/039 ,  G03F007/20 ,  G03F007/30 ,  G03F007/36

CPC classification number: G03F7/0758 ,  C08F220/30 ,  C08F230/08 ,  Y10T428/31663

Abstract: Novel copolymers suitable for forming the top layer photoimagable coating in a deep UV, particularly a 193 nm and 248 nm, bilayer resist system providing high resolution photolithography. Chemically amplified photoresist composition and organosilicon moieties suitable for use in the binder resin for photoimagable etching resistant photoresist composition that is suitable as a material for use in ArF and KrF photolithography using the novel copolymers.

Abstract translation: 适用于在深UV，特别是193nm和248nm的双层抗蚀剂体系中形成顶层可光成像涂层的新型共聚物，其提供高分辨率光刻。 化学扩增的光致抗蚀剂组合物和适用于粘合剂树脂的有机硅部分，用于光可光刻抗蚀光致抗蚀剂组合物，其适用于使用新型共聚物的ArF和KrF光刻中的材料。

公开(公告)号：US20030204035A1

公开(公告)日：2003-10-30

申请号：US10438132

申请日：2003-05-14

Applicant: Arch Specialty Chemicals Inc.

Inventor： Binod B. De ,  Sanjay Malik ,  Gregory Spaziano ,  John Joseph Biafore ,  Patrick Foster ,  Sidney George Slater ,  Thomas Steinhausler ,  Andrew J. Blakeney

IPC: C08L029/02

CPC classification number: G03F7/091 ,  C08F8/14 ,  C08F212/14 ,  C08F220/18 ,  C08F2220/306 ,  C08F2800/10 ,  C08F2810/20 ,  C09D133/14 ,  G03F7/0392 ,  G03F7/11 ,  C08F8/12 ,  C08F2220/285

Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1 wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the nullnullR4Onullnullp; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Abstract translation: 包含含羟基聚合物，氨基交联剂和热酸发生剂的热固化组合物的光刻用热固化底涂层，其中含羟基聚合物是包含下式的单元m，n和o的聚合物 ：其中R 1是H或甲基; R 2是取代或未取代的C 6 -C 14芳基丙烯酸酯或C 6 -C 14芳基甲基丙烯酸酯基，其中取代基可以是苯基，C 1-4烷基或C 1-4烷氧基; R 3是丙烯酸羟基官能化的C 1 -C 8烷基酯，甲基丙烯酸酯或C 6 -C 14芳基，R 4是C 1 -C 10直链或支链亚烷基; p是1至5的整数，条件是在[-R 4 O-] p中不超过30个碳原子; R 5是C 1 -C 10直链，支链或环状烷基，取代或未取代的C 6 -C 14芳基或取代或未取代的C 7 -C 15脂环族烃; m为约40至70，n为约15至35，o为约15至25。