中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.014 seconds)

    Thermally cured underlayer for lithographic application
    2.
    发明申请
    Thermally cured underlayer for lithographic application 失效
    用于光刻应用的热固化底层

    公开(公告)号：US20020173594A1

    公开(公告)日：2002-11-21

    申请号：US10093079

    申请日：2002-03-07

    Applicant: ARCH SPECIALTY CHEMICALS, INC.

    Inventor： Binod B. De ,  Sanjay Malik ,  Gregory Spaziano ,  John Joseph Biafore ,  Patrick Foster ,  Sidney George Slater ,  Thomas Steinhausler ,  Andrew J. Blakeney

    IPC: C08L029/02

    CPC classification number: G03F7/11 ,  C09D133/14

    Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1 wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or c6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the nullnullR4Onullnullp; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

    Abstract translation: 包含含羟基聚合物，氨基交联剂和热酸发生剂的热固化组合物的光刻用热固化底涂层，其中含羟基聚合物是包含下式的单元m，n和o的聚合物 其中R1是H或甲基; R2是取代或未取代的C6-C14芳基丙烯酸酯或C6-C14芳基甲基丙烯酸酯基，其中取代基可以是苯基，C 1-4烷基或C 1-4烷氧基; R3是丙烯酸羟基官能化的C1-C8烷基酯，甲基丙烯酸酯或c6-C14芳基，R4是C1-C10直链或支链亚烷基; p是1至5的整数，条件是在[-R4O-] p中不超过三十个碳原子; R5是C1-C10直链，支链或环状烷基，取代或未取代的C6-C14芳基或取代或未取代的C7-C15脂环族烃; m为约40至70，n为约15至35，o为约15至25。

    Thermally cured underlayer for lithographic application
    4.
    发明申请
    Thermally cured underlayer for lithographic application 失效
    用于光刻应用的热固化底层

    公开(公告)号：US20030204035A1

    公开(公告)日：2003-10-30

    申请号：US10438132

    申请日：2003-05-14

    Applicant: Arch Specialty Chemicals Inc.

    Inventor： Binod B. De ,  Sanjay Malik ,  Gregory Spaziano ,  John Joseph Biafore ,  Patrick Foster ,  Sidney George Slater ,  Thomas Steinhausler ,  Andrew J. Blakeney

    IPC: C08L029/02

    CPC classification number: G03F7/091 ,  C08F8/14 ,  C08F212/14 ,  C08F220/18 ,  C08F2220/306 ,  C08F2800/10 ,  C08F2810/20 ,  C09D133/14 ,  G03F7/0392 ,  G03F7/11 ,  C08F8/12 ,  C08F2220/285

    Abstract: Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula: 1 wherein R1 is H or methyl; R2 is a substituted or unsubstituted C6-C14 aryl acrylate or C6-C14 aryl methacrylate group wherein the substituted groups may be phenyl, C1-4 alkyl or C1-4 alkoxy; R3 is a hydroxyl functionalized C1-C8 alkyl acrylate, methacrylate or C6-C14 aryl group, R4 is a C1-C10 linear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the nullnullR4Onullnullp; R5 is a C1-C10 linear, branched or cyclic alkyl, substituted or unsubstituted C6-C14 aryl, or substituted or unsubstituted C7-C15 alicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

    Abstract translation: 包含含羟基聚合物，氨基交联剂和热酸发生剂的热固化组合物的光刻用热固化底涂层，其中含羟基聚合物是包含下式的单元m，n和o的聚合物 ：其中R 1是H或甲基; R 2是取代或未取代的C 6 -C 14芳基丙烯酸酯或C 6 -C 14芳基甲基丙烯酸酯基，其中取代基可以是苯基，C 1-4烷基或C 1-4烷氧基; R 3是丙烯酸羟基官能化的C 1 -C 8烷基酯，甲基丙烯酸酯或C 6 -C 14芳基，R 4是C 1 -C 10直链或支链亚烷基; p是1至5的整数，条件是在[-R 4 O-] p中不超过30个碳原子; R 5是C 1 -C 10直链，支链或环状烷基，取代或未取代的C 6 -C 14芳基或取代或未取代的C 7 -C 15脂环族烃; m为约40至70，n为约15至35，o为约15至25。

Patent Agency Ranking