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公开(公告)号:US09611654B2
公开(公告)日:2017-04-04
申请号:US14615944
申请日:2015-02-06
Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
Inventor: Dung V. Dao , Richard H. Balmer
CPC classification number: E04F15/02 , E04F15/105 , E04F15/18 , E04F15/181 , E04F2201/0511 , E04F2201/07
Abstract: A floor panel and a floating floor system include a top surface and a bottom surface. The top surface has a visible decorative pattern and the bottom surface has a recess which extends about the periphery of the bottom surface. The recess has a recess surface. The floor panel includes a joining member with a top surface and a bottom surface. The top surface of the joining member is adhered to the recess surface of the recess. The bottom surface of the joining member and the bottom surface of the floor panel are essentially flush which each other. The use of the joining member does not create any imprints on the top surface of the floor panel.
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公开(公告)号:US20150082741A1
公开(公告)日:2015-03-26
申请号:US14553770
申请日:2014-11-25
Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
Inventor: Richard H. Balmer , Shih Chung Lee , Dung V. Dao , John R. Eshbach, JR. , Heath E. Harrington , Michael E. Buckwalter , Kean M. Anspach
CPC classification number: B32B37/18 , B32B37/1284 , B32B38/0004 , B32B2037/268 , B32B2309/105 , B32B2419/04 , B32B2607/00 , E04F15/02155 , E04F15/10 , E04F2201/07 , E04F2203/06 , Y10T156/10 , Y10T156/1085 , Y10T156/1087
Abstract: A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.
Abstract translation: 制造地板镶板的方法包括以下步骤:在释放构件上提供粘合剂; 将释放构件层压或结合到底层,使得粘合剂位于释放构件和底层之间; 去除所述释放构件的一部分以暴露所述粘合剂的区域; 并且将顶层粘附到所述区域,使得顶层相对于底层在长度和宽度的方向上偏移,并且底层的顶表面的边缘端部和底表面的边缘端部 的顶层暴露。
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