公开(公告)号：US20150082741A1

公开(公告)日：2015-03-26

申请号：US14553770

申请日：2014-11-25

Applicant: ARMSTRONG WORLD INDUSTRIES, INC.

Inventor： Richard H. Balmer ,  Shih Chung Lee ,  Dung V. Dao ,  John R. Eshbach, JR. ,  Heath E. Harrington ,  Michael E. Buckwalter ,  Kean M. Anspach

IPC: B32B37/18 ,  B32B38/00 ,  E04F15/02 ,  B32B37/12

CPC classification number: B32B37/18 ,  B32B37/1284 ,  B32B38/0004 ,  B32B2037/268 ,  B32B2309/105 ,  B32B2419/04 ,  B32B2607/00 ,  E04F15/02155 ,  E04F15/10 ,  E04F2201/07 ,  E04F2203/06 ,  Y10T156/10 ,  Y10T156/1085 ,  Y10T156/1087

Abstract: A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.

Abstract translation: 制造地板镶板的方法包括以下步骤：在释放构件上提供粘合剂; 将释放构件层压或结合到底层，使得粘合剂位于释放构件和底层之间; 去除所述释放构件的一部分以暴露所述粘合剂的区域; 并且将顶层粘附到所述区域，使得顶层相对于底层在长度和宽度的方向上偏移，并且底层的顶表面的边缘端部和底表面的边缘端部 的顶层暴露。