公开(公告)号：US09153466B2

公开(公告)日：2015-10-06

申请号：US13871279

申请日：2013-04-26

Applicant: ASM IP Holding B.V.

Inventor： Lucian C. Jdira ,  Arjen Klaver ,  Klaas P. Boonstra ,  Chris G. M. De Ridder ,  Theodorus G. M. Oosterlaken

IPC: H01L21/673

CPC classification number: H01L21/67309 ,  H01L21/67303

Abstract: A wafer boat for accommodating semiconductor wafers comprises two side rods and at least one back rod, the rods being vertically oriented and extending between a top member and a bottom member. The rods comprise vertically spaced recesses formed at corresponding heights, recesses at the same height defining a wafer accommodation for receiving and supporting a wafer in a substantially horizontal orientation, the recesses having an improved shape. The upwardly facing surfaces of the recesses comprise a first flat surface in an inward region of the recess which is horizontal or inclined upward in an outward direction of the recess and a second flat surface in an outer region of the recess which is inclined downward in an outward direction of the recess. The intersection of the first and second surface forming an edge for supporting the wafer. The recesses are easy to machine and prevent damage to the wafer.

Abstract translation: 用于容纳半导体晶片的晶片舟包括两个侧杆和至少一个后杆，所述杆垂直定向并在顶部构件和底部构件之间延伸。 杆包括形成在相应高度处的垂直间隔开的凹部，在相同高度处的凹槽限定用于以基本上水平的方向接收和支撑晶片的晶片容置，所述凹部具有改进的形状。 凹槽的面向上的表面包括在凹部的向内区域中的第一平坦表面，其在凹部的向外方向上是水平的或向上倾斜的，并且在凹部的外部区域中的第二平坦表面在第一平坦表面中向下倾斜 凹槽的向外方向。 第一和第二表面的交点形成用于支撑晶片的边缘。 凹槽容易加工并防止损坏晶片。