Injector configured for arrangement within a reaction chamber of a substrate processing apparatus

    公开(公告)号:US11891696B2

    公开(公告)日:2024-02-06

    申请号:US17534604

    申请日:2021-11-24

    CPC classification number: C23C16/45578

    Abstract: The invention relates to an injector configured for arrangement within a reaction chamber of a substrate processing apparatus to inject gas in the reaction chamber. The injector may be elongated along a first axis and configured with an internal gas conduction channel extending along the first axis and provided with at least one gas entrance opening and at least one gas exit opening. The injector may have a width extending along a second axis perpendicular to the first axis substantially larger than a depth of the injector extending along a third axis perpendicular to the first and second axis. The wall of the injector may have a varying thickness.

    Apparatus for semiconductor wafer processing

    公开(公告)号:US10900122B2

    公开(公告)日:2021-01-26

    申请号:US16304526

    申请日:2016-05-27

    Abstract: A spatial atomic layer deposition apparatus (10), including a showerhead (16) with a showerhead side (18) having a center, a central area and a circumferential area. The apparatus also includes a susceptor (12) having a substrate support side that extends parallel to and of opposite the showerhead side forming a gap. The susceptor and the showerhead are rotatable relative to each other around an axis of rotation. The apparatus has a plurality of switchable showerhead sections. The apparatus also includes a plurality of multi-way valve assemblies. Each switchable showerhead section is fluidly connected with one of the plurality of multi-way valve assemblies, so as to fluidly connect a selected one of a plurality of different gas sources with that switchable showerhead section.

    Substrate processing apparatus with an injector

    公开(公告)号:US12195852B2

    公开(公告)日:2025-01-14

    申请号:US17530161

    申请日:2021-11-18

    Abstract: A substrate processing apparatus having a tube, a closed liner lining the interior surface of the tube, a plurality of gas injectors to provide a gas to an inner space of the liner, and, a gas exhaust duct to remove gas from the inner space is disclosed. The liner may have a substantially cylindrical wall delimited by a liner opening at a lower end and being substantially closed for gases above the liner opening. The apparatus may have a boat constructed and arranged moveable into the inner space via the liner opening and provided with a plurality of substrate holders for holding a plurality of substrates over a substrate support length in the inner space. Each of the gas injectors may have a single exit opening at the top and the exit openings of the plurality of injectors are substantially equally divided over the substrate support length.

    Atomic layer deposition apparatus

    公开(公告)号:US10954597B2

    公开(公告)日:2021-03-23

    申请号:US14660315

    申请日:2015-03-17

    Abstract: An atomic layer deposition apparatus including a deposition head that is rotatably mounted around a central deposition head axis and including a susceptor having an upper surface for carrying substrates. The lower surface comprises a plurality of process sections. Each process section includes a purge gas injection zone, a first precursor gas injection zone, a gas exhaust zone, a purge gas injection zone, a second precursor gas injection zone and a gas exhaust zone. Each zone radially extends from a radially inward part of the lower surface to a radially outward part of the lower surface of the deposition head. The combination of distance between the lower surface and the upper surface, the rotational speed of the deposition head and the flow rate and the pressure of the purge gas flows are selected such that the first and second precursor gases are substantially prevented from mixing.

    INJECTOR CONFIGURED FOR ARRANGEMENT WITHIN A REACTION CHAMBER OF A SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20240167158A1

    公开(公告)日:2024-05-23

    申请号:US18425643

    申请日:2024-01-29

    CPC classification number: C23C16/45578

    Abstract: The invention relates to an injector configured for arrangement within a reaction chamber of a substrate processing apparatus to inject gas in the reaction chamber. The injector may be elongated along a first axis and configured with an internal gas conduction channel extending along the first axis and provided with at least one gas entrance opening and at least one gas exit opening. The injector may have a width extending along a second axis perpendicular to the first axis substantially larger than a depth of the injector extending along a third axis perpendicular to the first and second axis. The wall of the injector may have a varying thickness.

    VERTICAL FURNACE REACTOR ASSEMBLY, METHOD OF ALIGNING ANNULAR FLANGE UNITS, AND USE

    公开(公告)号:US20220268520A1

    公开(公告)日:2022-08-25

    申请号:US17668614

    申请日:2022-02-10

    Abstract: Vertical furnace reactor assembly, comprising: a reactor housing defining a processing chamber configured for processing substrates therein, the processing chamber having an opening for moving substrates into and out of the processing chamber along a main loading axis, the opening being surrounded by a stack of annular flange units including at least two of a housing flange, a gas divided ring unit, a liner suspension ring unit, a scavenger ring unit and a clamp ring unit, wherein at least two of the annular flange units are provided with mutually cooperating centering structures for centering the respective at least two flange units with respect to each other, wherein the mutually cooperating centering structures comprise a plurality of slots and a corresponding plurality of pins, wherein the slots each extend along a respective main slot axis, wherein the slot axes are directed to mutually intersect centrally with respect to the stack.

    INJECTOR CONFIGURED FOR ARRANGEMENT WITHIN A REACTION CHAMBER OF A SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20220170156A1

    公开(公告)日:2022-06-02

    申请号:US17534604

    申请日:2021-11-24

    Abstract: The invention relates to an injector configured for arrangement within a reaction chamber of a substrate processing apparatus to inject gas in the reaction chamber. The injector may be elongated along a first axis and configured with an internal gas conduction channel extending along the first axis and provided with at least one gas entrance opening and at least one gas exit opening. The injector may have a width extending along a second axis perpendicular to the first axis substantially larger than a depth of the injector extending along a third axis perpendicular to the first and second axis. The wall of the injector may have a varying thickness.

    SUBSTRATE PROCESSING APPARATUS WITH AN INJECTOR

    公开(公告)号:US20220162751A1

    公开(公告)日:2022-05-26

    申请号:US17530161

    申请日:2021-11-18

    Abstract: A substrate processing apparatus having a tube, a closed liner lining the interior surface of the tube, a plurality of gas injectors to provide a gas to an inner space of the liner, and, a gas exhaust duct to remove gas from the inner space is disclosed. The liner may have a substantially cylindrical wall delimited by a liner opening at a lower end and being substantially closed for gases above the liner opening. The apparatus may have a boat constructed and arranged moveable into the inner space via the liner opening and provided with a plurality of substrate holders for holding a plurality of substrates over a substrate support length in the inner space. Each of the gas injectors may have a single exit opening at the top and the exit openings of the plurality of injectors are substantially equally divided over the substrate support length.

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