公开(公告)号：US20190390345A1

公开(公告)日：2019-12-26

申请号：US16014320

申请日：2018-06-21

Applicant: ASM IP Holding B.V.

Inventor： Takashi WADA ,  Satoru NOGUCHI ,  Wataru ADACHI ,  Daisuke MURAMATSU

IPC: C23C16/52 ,  C23C16/455

Abstract: Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.