公开(公告)号：US20190211450A1

公开(公告)日：2019-07-11

申请号：US15867669

申请日：2018-01-10

Applicant: ASM IP HOLDING B.V.

Inventor： Wataru ADACHI ,  Kazuo SATO

IPC: C23C16/455 ,  C23C16/50 ,  C23C16/458 ,  H01L21/02

CPC classification number: C23C16/45565 ,  C23C16/45527 ,  C23C16/458 ,  C23C16/50 ,  H01L21/02164 ,  H01L21/02274 ,  H01L21/0228

Abstract: A shower plate for a plasma deposition apparatus, the shower plate including: a plurality of apertures each extending from a rear surface of the shower plate to a front surface for passing a carrier gas therethrough in this direction to a chamber, a plurality of first apertures each extending from a first connecting aperture to an inner part of the front surface for passing gas therethrough in this direction to the chamber, and a plurality of second apertures each extending from a second connecting aperture to an outer part of the front surface for passing gas therethrough in this direction to the chamber, wherein the first connecting aperture connects the first apertures to at least one first aperture extending from a sidewall side of the shower plate and the second connecting aperture connects the second apertures to at least one second aperture extending from the sidewall side.

公开(公告)号：US20190390345A1

公开(公告)日：2019-12-26

申请号：US16014320

申请日：2018-06-21

Applicant: ASM IP Holding B.V.

Inventor： Takashi WADA ,  Satoru NOGUCHI ,  Wataru ADACHI ,  Daisuke MURAMATSU

IPC: C23C16/52 ,  C23C16/455

Abstract: Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.

公开(公告)号：US20190221432A1

公开(公告)日：2019-07-18

申请号：US15869716

申请日：2018-01-12

Applicant: ASM IP Holding B.V.

Inventor： Wataru ADACHI ,  Kazuo SATO

IPC: H01L21/285 ,  H01L21/687 ,  C23C16/44 ,  H01L21/67 ,  H01J37/32 ,  C23C16/458 ,  C23C16/505

CPC classification number: H01L21/28556 ,  C23C16/4404 ,  C23C16/4582 ,  C23C16/505 ,  H01J37/32449 ,  H01J37/32715 ,  H01L21/67161 ,  H01L21/68764 ,  H01L21/68792

Abstract: Examples of a substrate processing apparatus includes a chamber, a susceptor provided in the chamber, a flow control ring of an insulator that is mounted on the chamber and surrounds the susceptor, a shower plate opposed to the susceptor, and a metal film that is formed on a lower surface of the flow control ring while exposing an upper surface of the flow control ring, and is in contact with the chamber.