公开(公告)号：US20240178033A1

公开(公告)日：2024-05-30

申请号：US18523172

申请日：2023-11-29

Applicant: ASM IP Holding B.V.

Inventor： Jithin Prabha ,  Joseph Kraus ,  Pawan Rao

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67742 ,  H01L21/67109 ,  H01L21/68707

Abstract: A substrate cooling apparatus includes a cooling plate with a top surface including an array of embedded substrate support members protruding therefrom. A channel is disposed in an underside portion of the cooling plate, the conduit is embedded in the channel, a conduit comprising a coolant inlet at a first end and a coolant outlet at a second end, and a viscous thermally conductive material is disposed in the channel and is thermally coupled to an interior surface of the channel and an exterior surface of the conduit. One or more open recesses are disposed in a top surface of the cooling plate extending inward from a perimeter of the cooling plate toward a center point of the cooling plate, the open recesses disposed circumferentially on diametrically opposite sides of the cooling plate wherein the open recesses are sized to receive a corresponding substrate handling member of an indexer. Substrate transfer systems, cooling plate arrangements, and substrate transfer methods are also described.