公开(公告)号：USD990534S1

公开(公告)日：2023-06-27

申请号：US29750123

申请日：2020-09-11

Applicant: ASM IP Holding B.V.

Designer： Shreyans Kedia ,  Daniel Maurice ,  Govindarajasekhar Singu ,  Dinkar Nandwana ,  Frank Wing-Fung Cheng

Abstract: FIG. 1 is a top perspective view of a weighted lift pin showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 a bottom plan view thereof; and,
FIG. 6 is an exploded view thereof.

公开(公告)号：US20230183863A1

公开(公告)日：2023-06-15

申请号：US18079247

申请日：2022-12-12

Applicant: ASM IP Holding B.V.

Inventor： Shreyans Kedia ,  Dinkar Nandwana ,  Kyle Fondurulia ,  Todd Robert Dunn ,  Jereld Lee Winkler

IPC: C23C16/455

CPC classification number: C23C16/45544 ,  C23C16/45561 ,  C23C16/45565

Abstract: The present disclosure pertains to embodiments of a semiconductor deposition reactor manifold which can be used to deposit semiconductor layers using processes such as atomic layer deposition (ALD). The semiconductor deposition reactor manifold comprising heater blocks with heater elements mounted on a manifold body. Advantageously, the heater blocks are detachably mounted for easy replacement.