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公开(公告)号:USD1060598S1
公开(公告)日:2025-02-04
申请号:US29817804
申请日:2021-12-03
Applicant: ASM IP Holding B.V.
Designer: Shuyang Zhang , Ankit Kimtee
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公开(公告)号:US20240254629A1
公开(公告)日:2024-08-01
申请号:US18631858
申请日:2024-04-10
Applicant: ASM IP Holding B.V.
Inventor: Ankit Kimtee , Rohan Vijay Rane , Herbert Terhorst , Eric James Shero , Jereld Lee Winkler , Michael Schmotzer , Shuyang Zhang , Todd Robert Dunn , Shubham Garg
IPC: C23C16/458 , C23C16/46
CPC classification number: C23C16/4586 , C23C16/46
Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.
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公开(公告)号:US20230207377A1
公开(公告)日:2023-06-29
申请号:US18087871
申请日:2022-12-23
Applicant: ASM IP Holding B.V.
Inventor: Rohan Vijay Rane , Herbert Terhorst , Eric James Shero , Ankit Kimtee , Jereld Lee Winkler , Michael Schmotzer , Shuyang Zhang , Todd Robert Dunn , Shubham Garg
IPC: H01L21/687 , C23C16/44
CPC classification number: H01L21/68735 , C23C16/4408 , H01L21/68785
Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.
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