公开(公告)号：US20230212752A1

公开(公告)日：2023-07-06

申请号：US18147106

申请日：2022-12-28

Applicant: ASM IP Holding B.V.

Inventor： Zhengyan Zhou ,  Hong Gao

IPC: C23C16/46 ,  H01L21/687 ,  H05B3/28

CPC classification number: C23C16/46 ,  H01L21/68785 ,  H05B3/283 ,  H01J37/32357

Abstract: A substrate support includes a heater body, a heater element, and a heater terminal. The heater body is formed from a ceramic material and has upper and lower surfaces separated by a thickness. The heater element is arranged between the upper and lower surfaces and is embedded within the ceramic material forming the heater body. The heater terminal is arranged between the upper and lower surfaces, is electrically connected to the heater element, and has an electrode surface and a rounded surface. The electrode surface opposes the lower surface to flow an electric current to the heater element. The rounded surface opposes the upper surface and is embedded within the ceramic material to limit stress within the ceramic material during heating of a substrate seated on the upper surface of the heater body. Semiconductor processing systems and methods of making substrate supports for semiconductor processing systems are also described.