公开(公告)号：US20230212752A1

公开(公告)日：2023-07-06

申请号：US18147106

申请日：2022-12-28

Applicant: ASM IP Holding B.V.

Inventor： Zhengyan Zhou ,  Hong Gao

IPC: C23C16/46 ,  H01L21/687 ,  H05B3/28

CPC classification number: C23C16/46 ,  H01L21/68785 ,  H05B3/283 ,  H01J37/32357

Abstract: A substrate support includes a heater body, a heater element, and a heater terminal. The heater body is formed from a ceramic material and has upper and lower surfaces separated by a thickness. The heater element is arranged between the upper and lower surfaces and is embedded within the ceramic material forming the heater body. The heater terminal is arranged between the upper and lower surfaces, is electrically connected to the heater element, and has an electrode surface and a rounded surface. The electrode surface opposes the lower surface to flow an electric current to the heater element. The rounded surface opposes the upper surface and is embedded within the ceramic material to limit stress within the ceramic material during heating of a substrate seated on the upper surface of the heater body. Semiconductor processing systems and methods of making substrate supports for semiconductor processing systems are also described.

公开(公告)号：US12062565B2

公开(公告)日：2024-08-13

申请号：US17848824

申请日：2022-06-24

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  ChangMin Lee

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248

Abstract: Electrostatic chucks and methods of using electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a heating element embedded within the ceramic body, and two or more temperature measurement devices embedded within the ceramic body. Exemplary methods include measuring temperatures within the electrostatic chuck using two or more vertically spaced-apart temperature measurement devices.

公开(公告)号：US20230411198A1

公开(公告)日：2023-12-21

申请号：US18208421

申请日：2023-06-12

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Various embodiment of the present technology may provide an article formed from a ceramic material. The article may further include a protective coating overlying one or more surfaces of the article. The protective coating may include a first layer including aluminum and magnesium and a second layer including alumina, or alumina and magnesium oxide.

公开(公告)号：US20230389134A1

公开(公告)日：2023-11-30

申请号：US18201601

申请日：2023-05-24

Applicant: ASM IP Holding B.V.

Inventor： ChangMin Lee ,  Joaquin Aguilar Santillan ,  Nobuaki Tanabe ,  Hong Gao ,  Shanker Kuttath

IPC: H05B3/28 ,  C04B35/581 ,  C04B35/645 ,  C04B37/02 ,  H01L21/687

CPC classification number: H05B3/283 ,  C04B35/581 ,  C04B35/645 ,  C04B37/023 ,  H01L21/68757 ,  C04B2235/3865 ,  C04B2235/3206 ,  C04B2235/3222 ,  C04B2235/612 ,  C04B2237/366 ,  C04B2237/40 ,  C04B2237/80 ,  H05B2203/016 ,  H05B2203/017

Abstract: A method of manufacturing a heating block includes a first step of providing a ceramic material to a mold, a second step of sintering the ceramic material and forming a plate, and a third step of machining the plate. A shaft is connected to the plate in a fourth step, and rods are bonded to the plate in a fifth step of the method. Heating blocks and semiconductor processing systems having heating blocks are also described.

公开(公告)号：US20230013637A1

公开(公告)日：2023-01-19

申请号：US17857344

申请日：2022-07-05

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Shanker Kuttath ,  Hong Gao

IPC: C23C16/458 ,  C04B35/581 ,  C23C16/455 ,  C04B35/505 ,  C04B35/64 ,  C23C16/40

Abstract: A substrate support structure includes a substrate support structure body formed from a ceramic composite and having a first surface, a second surface spaced apart from the first surface, and a periphery spanning the first surface and the second surface of the substrate support structure body. The first surface, the second surface, and the periphery of the substrate support structure body are defined by the ceramic composite. The ceramic composite includes two or more of a (a) an aluminum nitride (AlN) constituent, (b) an aluminum oxynitride (Al2.81O3.56N0.44, AlON) constituent, (c) an alpha-alumina (α-Al2O3) constituent, (d) a yttrium alumina garnet (Y3Al5O12, YAG) constituent, (e) a yttrium alumina monoclinic (Y4Al2O9, YAM) constituent, (f) a yttrium alumina perovskite (YAlO3, YAP) constituent, and (g) a yttrium oxide (Y2O3) constituent. Semiconductor processing systems and methods of making substrate support structures are also described.

公开(公告)号：US20220415694A1

公开(公告)日：2022-12-29

申请号：US17848824

申请日：2022-06-24

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  ChangMin Lee

IPC: H01L21/683 ,  H01L21/67

Abstract: Electrostatic chucks and methods of using electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a heating element embedded within the ceramic body, and two or more temperature measurement devices embedded within the ceramic body. Exemplary methods include measuring temperatures within the electrostatic chuck using two or more vertically spaced-apart temperature measurement devices.

公开(公告)号：US20240297063A1

公开(公告)日：2024-09-05

申请号：US18662796

申请日：2024-05-13

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath

IPC: H01L21/683 ,  H01L21/67 ,  H05B3/12 ,  H05B3/18

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H05B3/12 ,  H05B3/18 ,  H05B2203/017

Abstract: Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.

公开(公告)号：US20240162077A1

公开(公告)日：2024-05-16

申请号：US18388661

申请日：2023-11-10

Applicant: ASM IP Holding B.V.

Inventor： Rajmohan Muthaiah ,  Shubham Garg ,  Todd Dunn ,  Hong Gao ,  Joaquin Aguilar Santillan ,  Arjav Prafulkumar Vashi

IPC: H01L21/687

CPC classification number: H01L21/68785 ,  H01L21/68742 ,  H01L21/68757

Abstract: Various embodiments of the present technology may provide an apparatus for use within a reaction chamber. The apparatus includes a susceptor plate having through-holes for which lift pins may be disposed therein. In addition, the susceptor may include an electrostatic chucking function. The susceptor may also include a metal interconnect that is electrically connected to other metal interconnects with a brazing material.

公开(公告)号：US20230235428A1

公开(公告)日：2023-07-27

申请号：US18100048

申请日：2023-01-23

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  Shaofeng Chen ,  Gary Urban Keppers ,  Felix Rabinovich

IPC: C22C1/02 ,  C22C21/08 ,  B22D21/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: C22C1/026 ,  C22C21/08 ,  B22D21/007 ,  H01L21/67167 ,  H01L21/68707 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: A substrate handling chamber body is formed from a castable aluminum alloy including a manganese (Mn) constituent and an iron (Fe) constituent. The castable aluminum alloy has a manganese (Mn) constituent-to-iron (Fe) constituent ratio that between about 1.125 and about 1.525 to limit microporosity and shrinkage porosity within the castable aluminum alloy forming the substrate handling chamber body. Semiconductor processing systems and methods of making substrate handling chamber bodies for semiconductor processing systems are also described.

公开(公告)号：US11996312B2

公开(公告)日：2024-05-28

申请号：US17570232

申请日：2022-01-06

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath

IPC: H01T23/00 ,  H01L21/67 ,  H01L21/683 ,  H05B3/12 ,  H05B3/18

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H05B3/12 ,  H05B3/18 ,  H05B2203/017

Abstract: Electrostatic chucks and methods of forming electrostatic chucks are disclosed. Exemplary electrostatic chucks include a ceramic body, a device embedded within the ceramic body, and an interface layer formed overlying the device. Exemplary methods include providing ceramic precursor material within a mold, providing a device, coating the device with an interface material to form a coated device, placing the coated device on or within the ceramic precursor material, and sintering the ceramic precursor material to form the electrostatic chuck and an interface layer between the device and ceramic material formed during the step of sintering.