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公开(公告)号：US11520241B2
公开(公告)日：2022-12-06
申请号：US16768766
申请日：2018-11-29
Applicant: ASML HOLDING N.V.
Inventor： Matthew Lipson , David Allen Heald , Iliya Sigal
IPC: G03F7/20 , H01L21/687
Abstract: Methods and systems are described for reducing adhesion and controlling friction between a wafer and a wafer table during semiconductor photolithography wherein the tops of burls on the wafer table have a layer with a nanoscale topography.
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