公开(公告)号：US12189310B2

公开(公告)日：2025-01-07

申请号：US17790341

申请日：2020-12-04

Applicant: ASML Holding N.V.

Inventor： Matthew Lipson ,  Mehmet Ali Akbas

IPC: G03F7/20 ,  C03C27/00 ,  G03F7/00 ,  H01L21/683

Abstract: Systems, apparatuses, and methods are provided for manufacturing an electrostatic clamp. An example method can include forming, during a first duration of time comprising a first time, a top clamp comprising a first set of electrodes and a plurality of burls. The method can further include forming, during a second duration of time comprising a second time that overlaps the first time, a core comprising a plurality of fluid channels configured to carry a thermally conditioned fluid. The method can further include forming, during a third duration of time comprising a third time that overlaps the first time and the second time, a bottom clamp comprising a second set of electrodes. In some aspects, the example method can include manufacturing the electrostatic clamp without an anodic bond.

公开(公告)号：US11520241B2

公开(公告)日：2022-12-06

申请号：US16768766

申请日：2018-11-29

Applicant: ASML HOLDING N.V.

Inventor： Matthew Lipson ,  David Allen Heald ,  Iliya Sigal

IPC: G03F7/20 ,  H01L21/687

Abstract: Methods and systems are described for reducing adhesion and controlling friction between a wafer and a wafer table during semiconductor photolithography wherein the tops of burls on the wafer table have a layer with a nanoscale topography.

公开(公告)号：US10908518B2

公开(公告)日：2021-02-02

申请号：US15984040

申请日：2018-05-18

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Santiago E. Delpuerto ,  Antonius Franciscus Johannes De Groot ,  Kenneth C. Henderson ,  Raymond Wilhelmus Louis Lafarre ,  Matthew Lipson ,  Louis John Markoya ,  Tammo Uitterdijk ,  Ronald Van Der Wilk ,  Johannes Petrus Martinus Bernardus Vermeulen

IPC: G03F7/20 ,  H01L21/683 ,  H01L21/687

Abstract: A lithographic apparatus is provided. The lithographic apparatus includes a reticle and an electrostatic clamp configured to releasably hold the reticle. The electrostatic clamp includes a first substrate having opposing first and second surfaces, a plurality of burls located on the first surface and configured to contact the reticle, a second substrate having opposing first and second surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

公开(公告)号：US10310391B2

公开(公告)日：2019-06-04

申请号：US15504749

申请日：2015-07-09

Applicant: ASML Holding N.V.

Inventor： Matthew Lipson ,  Vincent Dimilia ,  Ronald Peter Totillo ,  Tammo Uitterdijk ,  Steven Michael Zimmerman

IPC: G03B27/58 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  C03B23/20 ,  C03B25/02

Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.

公开(公告)号：US12111581B2

公开(公告)日：2024-10-08

申请号：US17291086

申请日：2019-10-22

Applicant: ASML Holding N.V.

Inventor： Mehmet Ali Akbas ,  Tammo Uitterdijk ,  Christopher John Mason ,  Matthew Lipson ,  David Hart Peterson ,  Michael Perry ,  Peter Helmus ,  Jerry Jianguo Deng ,  Damoon Sohrabibabaheidary

IPC: G03F7/20 ,  G03F7/00 ,  H01L21/687

CPC classification number: G03F7/707 ,  G03F7/70491 ,  H01L21/6875

Abstract: A method for reducing sticking of an object to a surface used in a lithography process includes receiving, at a control computer, instructions for a tool configured to modify the surface and forming, in a deterministic manner based on the instructions received at the control computer, a modified surface having a furrow and a ridge, wherein the ridge reduces the sticking by reducing a contact surface area of the modified surface. Another apparatus includes a modified surface that includes furrows and ridges forming a reduced contact surface area to reduce a sticking of an object to the modified surface, the ridges having an elastic property that causes the reduced contact surface area to increase when the plurality of ridges is elastically deformed.

公开(公告)号：US11016401B2

公开(公告)日：2021-05-25

申请号：US16610103

申请日：2018-05-01

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Matthew Lipson ,  Christopher John Mason ,  Damoon Sohrabibabaheidary ,  Jimmy Matheus Wilhelmus Van De Winkel ,  Bert Dirk Scholten

IPC: G03F7/20

Abstract: A method of dislodging contamination from a part of an apparatus used in a patterning process, the method including: providing a cleaning substrate into contact with the part of the apparatus while the part is attached to the apparatus, the cleaning substrate comprising a material configured to chemically react with the contamination; and dislodging contamination on the part of the apparatus by chemical reaction between the material and the contamination.

公开(公告)号：US11988971B2

公开(公告)日：2024-05-21

申请号：US17612679

申请日：2020-05-05

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Matthew Lipson ,  Satish Achanta ,  Benjamin David Dawson ,  Matthew Anthony Sorna ,  Iliya Sigal ,  Tammo Uitterdijk

IPC: G03F7/00

CPC classification number: G03F7/70716

Abstract: A substrate table for supporting a substrate includes a surface and coarse burls. Each of the coarse burls includes a burl-top surface and fine burls. The coarse burls are disposed on the surface of the substrate table. The fine burls are disposed on the burl-top surface. The fine burls contact the substrate when the substrate table supports the substrate.

公开(公告)号：US10001713B2

公开(公告)日：2018-06-19

申请号：US14762452

申请日：2014-02-05

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Santiago E. Del Puerto ,  Matthew Lipson ,  Kenneth C. Henderson ,  Raymond Wilhelmus Louis LaFarre ,  Louis John Markoya ,  Tammo Uitterdijk ,  Johannes Petrus Martinus Bernardus Vermeulen ,  Antonius Franciscus Johannes De Groot ,  Ronald Van Der Wilk

IPC: G03B27/52 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: G03F7/70875 ,  G03F7/70708 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6875

Abstract: A support such as a clamp (310) is configured to releasably hold a patterning device such as a reticle (300) to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate (312) having opposing first (313) and second (315) surfaces, a plurality of burls (316) located on the first surface and configured to contact the reticle, a second substrate (314) having opposing first (317) and second (319) surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements (318) are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

公开(公告)号：US11009803B2

公开(公告)日：2021-05-18

申请号：US16587483

申请日：2019-09-30

Applicant: ASML Netherlands B.V. ,  ASML Holding N.V.

Inventor： Matthias Kruizinga ,  Maarten Mathijs Marinus Jansen ,  Jorge Manuel Azeredo Lima ,  Erik Willem Bogaart ,  Derk Servatius Gertruda Brouns ,  Marc Bruijn ,  Richard Joseph Bruls ,  Jeroen Dekkers ,  Paul Janssen ,  Mohammad Reza Kamali ,  Ronald Harm Gunther Kramer ,  Robert Gabriël Maria Lansbergen ,  Martinus Hendrikus Antonius Leenders ,  Matthew Lipson ,  Erik Roelof Loopstra ,  Joseph H. Lyons ,  Stephen Roux ,  Gerrit Van Den Bosch ,  Sander Van Den Heijkant ,  Sandra Van Der Graaf ,  Frits Van Der Meulen ,  Jérôme François Sylvain Virgile Van Loo ,  Beatrijs Louise Marie-Joseph Katrien Verbrugge

IPC: G03F1/64 ,  G03F7/20

Abstract: A mask assembly suitable for use in a lithographic process, the mask assembly comprising a patterning device; and a pellicle frame configured to support a pellicle and mounted on the patterning device with a mount; wherein the mount is configured to suspend the pellicle frame relative to the patterning device such that there is a gap between the pellicle frame and the patterning device; and wherein the mount provides a releasably engageable attachment between the patterning device and the pellicle frame.

公开(公告)号：US10274842B2

公开(公告)日：2019-04-30

申请号：US15504749

申请日：2015-07-09

Applicant: ASML Holding N.V.

Inventor： Matthew Lipson ,  Vincent Dimilia ,  Ronald Peter Totillo ,  Tammo Uitterdijk ,  Steven Michael Zimmerman

IPC: G03B27/58 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  C03B23/20 ,  C03B25/02

Abstract: An electrostatic clamp (300) and a method for manufacturing the same is disclosed. The electrostatic clamp includes a first layer (302) having a first ultra-low expansion (ULE) material, a second layer (304) coupled to the first layer, having a second ULE material, and a third layer (306), coupled to the second layer, having a third ULE material. The electrostatic clamp further includes a plurality of fluid channels (316) located between the first layer and the second layer and a composite layer (308) interposed between the second layer and the third layer. The method for manufacturing the electrostatic clamp includes forming the plurality of fluid channels, disposing the composite layer on the third layer, and coupling the third layer to the second layer. The plurality of fluid channels is configured to carry a thermally conditioned fluid for temperature regulation of a clamped object.