公开(公告)号：US11927889B2

公开(公告)日：2024-03-12

申请号：US17430275

申请日：2020-01-27

Applicant: ASML Holding N.V.

Inventor： Kushal Sandeep Doshi ,  Eric Justin Monkman ,  John Robert Burroughs ,  Sudhanshu Nahata ,  Stefan Luka Colton

IPC: G03F7/00

CPC classification number: G03F7/70716 ,  G03F7/70741 ,  G03F7/70808 ,  G03F7/7085 ,  G03F7/7095

Abstract: An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus under an applied force. The apparatus can further include a bonding layer disposed between the first and second substrates. The bonding layer is configured to bond the intermediate layer to the first and second substrates. The apparatus can further include a fastener coupled to the first and second substrates. The fastener is configured to secure the intermediate layer to the first and second substrates. The intermediate layer can include a coating applied to the first substrate or the second substrate. The apparatus can further include a second intermediate layer disposed between the first substrate and the fastener or the second substrate and the fastener.