公开(公告)号：US11567413B2

公开(公告)日：2023-01-31

申请号：US17430517

申请日：2020-01-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Chang An Wang ,  Alvin Jianjiang Wang ,  Jiao Liang ,  Jen-Shiang Wang ,  Mu Feng

IPC: G03F7/20

Abstract: A method for determining measurement data of a printed pattern on a substrate. The method involves obtaining (i) images of the substrate including a printed pattern corresponding to a reference pattern, (ii) an averaged image of the images, and (iii) a composite contour based on the averaged image. Further, the composite contour is aligned with respect to a reference contour of the reference pattern and contours are extracted from the images based on both the aligned composite contour and the output of die-to-database alignment of the composite contour. Further, the method determines a plurality of pattern measurements based on the contours and the measurement data corresponding to the printed patterns based on the plurality of the pattern measurements. Further, the method determines a one or more process variations such as stochastic variation, inter-die variation, intra-die variation and/or total variation.